Kitchen Console Cooking Surface With High-Emissivity Lower Panel
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Solution Overview
Problem
Existing cooking surfaces require significant space between upper and lower components and often necessitate a cooling fan to manage thermal load, with direct contact to the console surface needed for protection from heat emission.
Innovation Solution
The outer surface of the lower component is structured for enhanced heat emission through specific roughening or coating, achieving a radiant heat emission value of at least 0.5, allowing reduced spacing without a cooling fan and eliminating the need for an intermediate bottom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the space between upper and lower components is reduced, then the overall size of the cooking surface is minimized, but thermal load management becomes problematic without adequate cooling
Solution Approach 1:
The patent converts the harmful heat emission into a beneficial feature by designing the lower component to actively radiate heat downward. The outwardly facing surface is specifically structured with high emissivity (≥0.5) to dissipate thermal energy, transforming what would normally be a harmful thermal accumulation into a useful cooling mechanism that enables reduced spacing between components.
Solution Approach 2:
The patent changes the thermal radiation parameter by modifying the emissivity of the lower component's outwardly facing surface. By achieving an emissivity value of at least 0.5 (preferably ≥0.9), the surface efficiently radiates heat in the infrared spectrum, fundamentally altering the thermal management approach from passive conduction to active radiation, thereby enabling compact design without compromising thermal safety.
2Temperature
If a cooling fan is used to manage thermal load, then temperature control is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the cooling fan from the system by implementing an alternative passive thermal management approach. The lower component itself is designed as the heat dissipation element through high emissivity surface treatment, removing the need for active cooling mechanisms and their associated complexity, moving parts, and energy consumption.
Solution Approach 2:
The lower component performs dual functions: structural support and active heat dissipation. By incorporating high emissivity surface treatment directly onto the lower component, the system uses the component itself to manage thermal load without requiring separate cooling systems, achieving self-service thermal management that reduces overall device complexity.
3Ease of operation
If direct contact with the console surface is allowed, then installation is simplified, but the console is exposed to harmful heat emission
Solution Approach 1:
The patent converts the harmful heat emission toward the console into a beneficial cooling effect by directing the high emissivity surface to radiate heat downward. The lower component's outwardly facing surface with emissivity ≥0.5 actively dissipates heat away from the cooking chamber and toward the surrounding air and console interface, transforming potential thermal damage into useful thermal management.
Solution Approach 2:
The lower component acts as an intermediary between the cooking chamber and the console surface. Its high emissivity surface serves as a thermal buffer that radiates heat away, preventing direct heat transfer to the console while still allowing physical contact installation. This intermediary function protects the console from harmful thermal exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the space between components, improves heat dissipation, and simplifies installation by minimizing the temperature of the outwardly facing surface, thereby eliminating the need for an intermediate bottom and reducing thermal load on the console.
Implementation Method 1
structuring the outer surface of the lower component such that its degree of outward heat emission is at least 0.5
Implementation Method 2
the dissipation of heat from the lower component of the installed cooking surface into the layer of air therebelow is further improved
Data Source
AI summary
A cooking surface of box-like structure for installation in the work surface of a kitchen console provided with a lower component having an outwardly facing surface providing for a degree of radiant heat emission in excess of 5, preferably from 0.9 to 0.95, and an inwardly facing surface providing for a degree of radiant heat reflection in excess of 0.5, preferably between 0.9 and 0.95.