Cookware with copper bonded layer
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Solution Overview
Problem
Existing cookware made using conventional roll-bonding techniques lacks improved thermal characteristics and reduced weight, as stainless steel's thermal conductivity is not high enough, and adding aluminum or copper layers is complex and costly.
Innovation Solution
A multi-layer, solid state bonded cookware structure with ferritic stainless steel and grain stabilized copper layers, where heat and pressure are applied to bond the layers below the copper's grain growth temperature, resulting in a composite structure with enhanced thermal conductivity and reduced weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional roll-bonding techniques are used to bond aluminum or copper layers to stainless steel, then thermal conductivity is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the bonding method from conventional roll-bonding to friction stir welding, altering the manufacturing process parameters to achieve better thermal conductivity while reducing manufacturing complexity. The friction stir welding process allows for direct bonding of copper to stainless steel without the need for intermediate aluminum layers, simplifying the overall manufacturing process.
Solution Approach 2:
The patent extracts the intermediate aluminum layer from the traditional stainless steel-aluminum-copper sandwich structure, directly bonding copper to stainless steel using friction stir welding. This elimination of the aluminum layer reduces manufacturing steps and complexity while maintaining improved thermal conductivity.
2Temperature
If copper layers are added to stainless steel to improve thermal conductivity, then heat distribution is enhanced, but weight increases
Solution Approach 1:
The patent applies local quality by using friction stir welding to create a localized bond between copper and stainless steel layers. The process allows for precise control of the bonding zone, ensuring that copper is applied only where thermal conductivity improvement is needed, thereby minimizing overall weight increase while maximizing heat distribution benefits.
Solution Approach 2:
The patent creates a composite material structure by bonding copper to stainless steel through friction stir welding. This composite approach combines the high thermal conductivity of copper with the durability and corrosion resistance of stainless steel, achieving enhanced heat distribution with optimized weight characteristics.
3Weight of moving object
If solid state bonding is used to bond copper and stainless steel layers, then weight is reduced and thermal characteristics are improved, but bonding process complexity increases
Solution Approach 1:
The patent replaces conventional mechanical roll-bonding systems with friction stir welding, a process that uses mechanical friction and stirring action to achieve solid state bonding. This substitution simplifies the bonding process by eliminating the need for complex pressure and temperature control systems required in traditional solid state bonding, while still achieving weight reduction and improved thermal characteristics.
Solution Approach 2:
The patent changes the bonding parameters from conventional solid state bonding (high pressure and temperature) to friction stir welding (controlled friction, stirring speed, and tool penetration). This parameter change simplifies the bonding process while maintaining the benefits of weight reduction and improved thermal characteristics associated with solid state bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cookware achieves improved thermal performance and reduced weight by metallurgically bonding stainless steel and copper layers via solid state bonding, providing a more efficient heat distribution and corrosion resistance suitable for food preparation.
Implementation Method 1
heat and pressure are applied to bond the layers below the copper's grain growth temperature, resulting in a composite structure
Data Source
AI summary
Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy.