Coolant Tube Block Assembly for Cryogenic Vacuum Leak Prevention

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Solution Overview

Problem

Conventional coolant tube structures in semiconductor processing devices experience cumulative tolerances and vacuum leakage due to cryogenic coolants, particularly during cryogenic etching processes in vertical NAND semiconductor manufacturing, where temperature control is critical.

Innovation Solution

A coolant tube block assembly with a clamp and hub block configuration allows for differential thermal expansion between upper and lower coolant tube blocks, using materials with varying thermal expansion coefficients to minimize contraction forces and prevent leakage, and an elastic member supports the assembly to reduce cumulative tolerance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional coolant tube structure with stacked upper and lower coolant tube blocks is used, then cooling function is provided, but cumulative tolerances and vacuum leakage occur due to partial contraction caused by cryogenic coolants

Engineering Contradiction:
Improvecooling functionVSAvoidvacuum leakage
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies thermal expansion principle by selecting materials with different thermal expansion coefficients for the upper and lower coolant tube blocks. The lower block uses a material with a higher thermal expansion coefficient than the upper block, allowing differential expansion and contraction behavior that compensates for cumulative tolerances and prevents vacuum leakage during cryogenic cooling operations.

Inventive Principle:
Principle #37Thermal expansion

2Ease of manufacture

If stacked coolant tube blocks are connected with bolts, then assembly is achieved, but cumulative tolerances occur due to partial contraction

Engineering Contradiction:
ImproveassemblyVSAvoidcumulative tolerances
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

By using materials with different thermal expansion coefficients in the upper and lower blocks, the invention creates a differential expansion mechanism that actively compensates for cumulative tolerances that would otherwise accumulate from bolted connections during assembly and cryogenic operation.

Inventive Principle:
Principle #37Thermal expansion

3Ease of manufacture

If the same material is used for upper and lower coolant tube blocks, then manufacturing is simplified, but contraction forces cause vacuum leakage

Engineering Contradiction:
Improvematerial selectionVSAvoidvacuum leakage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local quality principle by using different materials for the upper and lower coolant tube blocks. Specifically, the lower block uses a material with a higher thermal expansion coefficient than the upper block, creating localized material property differences that enable differential thermal behavior to prevent vacuum leakage while maintaining overall manufacturing feasibility.

Inventive Principle:
Principle #3Local quality

4Stability of the object's composition

If a rigid connection method is used between substrate plate and coolant tube block, then structural stability is achieved, but leakage occurs due to thermal contraction

Engineering Contradiction:
Improvestructural stabilityVSAvoidleakage
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The differential thermal expansion between upper and lower blocks creates a flexible connection system that maintains structural stability while accommodating thermal contraction during cryogenic operation, preventing leakage without requiring rigid fixed connections.

Inventive Principle:
Principle #37Thermal expansion

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces vacuum leakage and cumulative tolerance issues by ensuring close contact between coolant tube blocks and the substrate plate, maintaining chamber vacuum integrity during cryogenic processes.

Implementation Method 1

an elastic member supports the assembly to reduce cumulative tolerance

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

using materials with varying thermal expansion coefficients to minimize contraction forces

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20240379334A1Coolant tube block assembly and semiconductor processing device including the same
Publication Date: 2024.11.14 SAMSUNG ELECTRONICS CO LTD
  • US20240379334A1 patent drawing
  • US20240379334A1 patent drawing
  • US20240379334A1 patent drawing

AI summary

An example coolant tube block assembly includes a first coolant tube block including at least one of a first coolant flow path tube and a second coolant flow path tube; a hub block configured to expose at least one of the first coolant flow path tube and the second coolant flow path tube on one side, and connected to a lower side of the first coolant tube block; a second coolant tube block including at least one third coolant flow path tube and at least one fourth coolant flow path tube communicating with at least one of the first coolant flow path tube and the second coolant flow path tube, and stacked with the first coolant tube block through the hub block; and a clamp disposed at a lower portion of the second coolant tube block and fastened to a fastening groove formed outside the hub block.