Coolant-Channel Chamber Adapter for External Temperature Control

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Solution Overview

Problem

Process chambers, such as physical deposition (PVD) chambers, often exceed the external temperature limit of 65° C as per SEMI S2 guidelines, posing a safety risk and requiring effective temperature control methods without affecting the internal thermal environment.

Innovation Solution

The implementation of an adapter system for process chambers that includes a coolant channel within the adapter body, which is strategically positioned to manage external surface temperatures by circulating coolant, ensuring the external surfaces remain below 65° C while maintaining the internal thermal environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the process chamber operates at high temperature for microelectronic device fabrication, then the internal thermal environment is maintained for processing, but the external surface temperature exceeds the safety limit of 65° C

Engineering Contradiction:

Improveinternal temperatureVSAvoidexternal surface temperature

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The adapter body is divided into distinct functional zones: a radially outer portion containing the connection surface for mechanical coupling, and a radially inner portion containing the coolant channel for thermal management. This segmentation allows independent optimization of mechanical connection and thermal control functions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A coolant channel is introduced as an intermediary thermal management system between the heat-generating process chamber and the external environment. The coolant circulates through the channel to absorb excess heat from the adapter body, preventing heat transfer to external surfaces while maintaining internal processing temperatures.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If a coolant channel is added to control external temperature, then external surface temperature is reduced below 65° C, but the device structure becomes more complex

Engineering Contradiction:

Improveexternal surface temperatureVSAvoidadapter structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The coolant channel is integrated directly into the adapter body structure, merging the thermal management function with the mechanical support structure. This eliminates the need for separate external cooling components and reduces overall system complexity despite adding internal cooling capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The adapter body serves multiple functions simultaneously: it provides mechanical connection between the process chamber and external systems through the connection surface, supports the coolant channel for thermal management, and maintains structural integrity. This multi-functionality reduces the need for additional separate components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively controls external surface temperatures of process chambers, adhering to safety standards while preserving the internal thermal conditions necessary for microelectronic device fabrication.

Implementation Method 1

a radially inner portion having a coolant channel... At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is also disposed longitudinally below the connection surface

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS12183559B2Apparatus for temperature control in a substrate processing chamber

Publication Date: 2024.12.31 APPLIED MATERIALS INC

AI summary

An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.