Coolant-Cooled Gas Injector for Film Deposition
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Solution Overview
Problem
In film deposition processes, particularly for high dielectric films like hafnium oxide, maintaining a high deposition temperature to reduce impurities leads to thermal decomposition of source gases, causing residue attachment to gas injector surfaces, increasing particle release and maintenance frequency, which complicates the deposition of high-quality films.
Innovation Solution
A film deposition apparatus with a rectifying member and coolant flow passage along the gas injector, circulating coolant to maintain the source gas temperature below decomposition levels, preventing pyrolytic decomposition and residue adhesion on the injector surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the film deposition temperature is set high to reduce impurities, then the film quality is improved, but the source gas undergoes thermal decomposition and attaches to the gas injector surface
Solution Approach 1:
The gas injector is cooled locally by circulating coolant through its internal passages, creating a temperature gradient where the injector surface remains cool while the substrate maintains high deposition temperature. This localized temperature control prevents source gas decomposition at the injector while allowing high-quality film formation at the substrate.
Solution Approach 2:
The temperature parameter of the gas injector is changed by introducing coolant circulation, transforming it from a hot surface that causes decomposition to a cool surface that prevents adhesion. This parameter change resolves the contradiction by decoupling the temperature requirements of the injector and substrate.
2Manufacturing precision
If the film deposition temperature is set high to reduce impurities, then the film quality is improved, but the maintenance frequency of the gas injector increases
Solution Approach 1:
The gas injector is pre-cooled by coolant circulation before source gas supply begins, preventing decomposed matter adhesion from occurring in the first place. This preliminary temperature control action eliminates the need for frequent maintenance interventions.
3Manufacturing precision
If the film deposition temperature is set high to reduce impurities, then the film quality is improved, but particle generation increases due to decomposed matter release
Solution Approach 1:
By cooling only the gas injector region while maintaining high substrate temperature, the system creates distinct thermal zones. The cool injector prevents source gas decomposition and particle generation, while the hot substrate ensures high-quality film deposition, resolving the contradiction between film quality and particle generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for higher film deposition temperatures without frequent maintenance, reducing particle generation and impurities, enhancing the quality and deposition rate of high-quality thin films while minimizing waste and material costs.
Implementation Method 1
when the film deposition temperature is set at a decomposition temperature of a source gas or higher, a decomposed matter is attached to an inner wall of a gas injector due to the thermal decomposition of the source gas
Implementation Method 2
The heating mechanism is configured to heat the substrate on the turntable
Implementation Method 3
The rectifying member is arranged on an upstream side and a downstream side of the gas injector in a rotational direction of the turntable so as to extend along a longitudinal direction of the gas injector and includes a coolant flow passage formed therein
Data Source
AI summary
In discharging a source gas from a first process gas nozzle, rectifying members including a coolant flow passage provided in a concertinaing manner therein are arranged both sides of the first process gas nozzle. Then, a coolant at a temperature higher than a liquefaction temperature of the source gas and lower than a thermal decomposition temperature of the source gas is flown through the coolant flow passage, by which the first process gas nozzle is cooled through the rectifying member.