Liquid Cooling Flow Channel Layout for Uniform Chip Temperature
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Solution Overview
Problem
Existing liquid cooling solutions for electronic devices fail to achieve uniform temperature distribution across chips due to significant temperature differences along the width direction of the flow channel, leading to performance issues and potential device malfunctions.
Innovation Solution
A liquid cooling apparatus with a confluence structure between the medium outlet and heat dissipation fins, where the distance between confluence plates increases towards the fins, ensuring uniform flow velocity and temperature across the width of the flow channel, enhancing temperature consistency among chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If heat dissipation fins are added within flow channels of liquid cooling plates, then heat dissipation capability is improved, but temperature uniformity across chips deteriorates due to significant temperature differences among chips along the width direction
Solution Approach 1:
The flow channel is segmented into multiple sub-channels by dividing plates with through-holes. This segmentation creates multiple flow paths that distribute the cooling medium more uniformly across the width direction, reducing temperature differences between chips at different lateral positions while maintaining effective heat dissipation through the fins in each sub-channel.
Solution Approach 2:
The distance between the dividing plate and heat dissipation fins is designed to vary in the width direction, creating local quality variations. This allows regions with higher chip density or greater heat generation to receive enhanced cooling flow, thereby improving temperature uniformity across different chip positions without compromising overall heat dissipation capability.
2Power
If cooling medium flows through the flow channel, then heat dissipation is achieved, but flow velocity uniformity across the width direction deteriorates, leading to non-uniform temperature distribution
Solution Approach 1:
The flow channel is divided into multiple sub-channels by dividing plates, which segment the cooling medium flow into parallel paths. This segmentation promotes more uniform flow velocity distribution across the width direction by preventing flow concentration in specific regions, thereby achieving both effective heat dissipation and uniform flow characteristics.
Solution Approach 2:
The dividing plate acts as an intermediary structure that introduces flow resistance and guides the cooling medium through controlled paths. The through-holes in the dividing plate serve as flow mediators that distribute the cooling medium uniformly across different sub-channels, ensuring consistent flow velocity and temperature distribution across all chip positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform heat dissipation across chips, improving performance and extending the service life of the circuit board by maintaining consistent flow velocities and temperatures, reducing junction temperatures by 1-2°C and enhancing temperature uniformity by 40%.
Implementation Method 1
each of the chips is in contact with a corresponding region of the medium flow channel
Implementation Method 2
a medium flow channel being arranged in the housing, wherein the medium flow channel is in communication with the medium inlet and the medium outlet
Implementation Method 3
a plurality of heat dissipation fins are spaced apart along a width direction of the medium flow channel within the medium flow channel
Data Source
AI summary
Disclosed are a liquid cooling apparatus and an electronic device. The liquid cooling apparatus includes a housing. A medium outlet, a medium inlet, and a medium flow channel are arranged on the housing. A plurality of heat dissipation fins are spaced apart within the medium flow channel. A space between the medium outlet and the heat dissipation fins within the medium flow channel forms a confluence region, wherein a confluence structure is arranged within the confluence region. The confluence structure includes a first confluence plate and a second confluence plate oppositely and spacedly arranged in the width direction, wherein a distance between the first confluence plate and the second confluence plate increases along a direction from the medium outlet towards the heat dissipation fins.