Coolant Flow Inverter Layout for Low-Flow Semiconductor Cooling
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Solution Overview
Problem
Existing cooling systems for power semiconductor components face inefficiencies in heat dissipation, particularly at low flow rates, leading to significant temperature increases and reduced current capability, which affects the reliability and cost-effectiveness of power modules.
Innovation Solution
A flow inverter design with a specific configuration of plates and walls that redirects coolant flow within a cooling chamber, utilizing recesses and curved shapes to enhance heat dissipation by directing coolant to optimal regions, thereby improving cooling homogeneity and reducing the number of power modules required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional cooling systems are used for power semiconductor components, then the system structure is simple, but the cooling efficiency is insufficient especially at low flow rates leading to significant temperature increases
Solution Approach 1:
The cooling system is segmented into multiple functional zones using flow inverters that divide the cooling chamber into different flow paths. These flow inverters create separate regions for different flow rates and cooling intensities, allowing optimized cooling in each zone rather than uniform cooling throughout.
Solution Approach 2:
Different regions of the cooling chamber are provided with different local cooling qualities through the flow inverter structure. Areas with higher heat generation receive targeted cooling enhancement while other areas maintain standard cooling, optimizing overall system efficiency without uniform complexity throughout.
2Use of energy by moving object
If coolant flow rate is reduced to lower energy consumption, then energy efficiency improves, but temperature gradients increase and current capability decreases
Solution Approach 1:
The flow inverter system dynamically adjusts coolant distribution to create varying flow rates in different regions. By dynamically redirecting flow paths, the system maintains adequate cooling performance and current capability even when overall flow rate is reduced for energy efficiency.
Solution Approach 2:
The system changes the flow rate parameter locally across different zones of the cooling chamber. By creating regions with different flow characteristics, the system achieves energy efficiency at lower overall flow rates while maintaining reliability through localized high-flow regions where needed.
3Temperature
If uniform cooling is provided across all regions, then manufacturing is simple, but temperature gradients cannot be effectively reduced leading to poor cooling homogeneity
Solution Approach 1:
Instead of providing uniform cooling throughout, the system inverts the approach by creating non-uniform flow distribution with flow inverters that redirect coolant to specific regions. This inversion of the uniform cooling concept allows effective temperature gradient reduction through targeted cooling zones.
Solution Approach 2:
The cooling system transitions from a single-dimension uniform approach to a multi-dimensional differentiated approach by adding vertical and horizontal zoning through flow inverters. This creates a three-dimensional cooling structure with varying flow characteristics across different spatial dimensions, improving temperature homogeneity without simple planar expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flow inverter effectively reduces temperature gradients and enhances cooling efficiency, allowing for higher current ratings and improved reliability of power semiconductor modules, even at low flow rates, by optimizing coolant flow and heat dissipation patterns.
Implementation Method 1
The flow inverter (1) is configured to redirect a proportion of the coolant substance (18) flowing in a bottom part (X') of the cooling chamber in flow direction (FD) before the flow inverter (1) to a top part (Y') of the cooling chamber in flow direction (FD) after the flow inverter (1). The flow inverter (1) is configured to redirect a proportion of the coolant substance (18) flowing in a top part (X) of the cooling chamber in flow direction (FD) before the flow inverter (1) to a region close to a bottom part (Y) of the cooling chamber in flow direction (FD) after the flow inverter (1).
Data Source
Figure 1~3
Figure 4~5
Figure 6
AI summary
A flow inverter (1) for a coolant substance (18) for a power semiconductor component (16) is specified, comprising - a first plate (2) extending along a main extension plane of the flow inverter (1), - a second plate (3) extending along the main extension plane, - a first wall (4) provided on the first plate (2) and the second plate (3) from a first main side of the flow inverter (1), and - a second wall (5) provided on the first plate (2) and the second plate (3) from a second main side of the flow inverter (1) opposite the first main side, wherein - the first plate (2) is provided next to the second plate (3), - at least one first recess (6) is provided between the first plate (2) and the second plate (3), and - at least one second recess (7) is provided between the first plate (2) and the second plate (3). Further, a power semiconductor component (16) is specified.