Adjusting Coolant Flow to Extend Substrate Heater Temperature Range
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Solution Overview
Problem
Existing substrate processing apparatuses have limited temperature control ranges due to adhesive strength degradation at high temperatures and low thermal conductivity of configuration members, as well as cooling capacity limitations, which restrict the ability to maintain stable substrate temperatures during processing.
Innovation Solution
A substrate processing apparatus with a chiller, coolant channels, and a flow rate control valve that adjusts the coolant flow rate through a bypass channel, allowing for controlled thermal conductivity changes to extend the temperature control range without compromising cooling capacity, using a mounting table with identical heater structures under the substrate and focus ring supporting surfaces to maintain uniform thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the coolant flow rate is increased to improve cooling capacity, then the cooling performance is improved, but the thermal conductivity of the mounting table becomes too high which limits the temperature control range
Solution Approach 1:
The patent applies dynamics by making the coolant flow rate adjustable rather than fixed. The flow rate control valve dynamically changes the flow rate based on processing requirements, allowing the system to adapt between high cooling capacity (high flow rate) and extended temperature control range (low flow rate), thus resolving the contradiction between cooling performance and temperature control versatility
Solution Approach 2:
The patent changes the physical parameter of coolant flow rate to control thermal conductivity. By adjusting the flow rate parameter, the system can change the thermal conductivity of the mounting table, enabling extended temperature control range while maintaining adequate cooling capacity when needed
2Adaptability or versatility
If the coolant flow rate is decreased to extend temperature control range, then the temperature control versatility is improved, but the cooling capacity becomes insufficient
Solution Approach 1:
The system dynamically adjusts the coolant flow rate using a flow rate control valve, allowing operation at low flow rates to extend temperature control range while maintaining the capability to increase flow rate when high cooling capacity is required, thus resolving the contradiction between temperature control versatility and cooling capacity
3Adaptability or versatility
If high temperature is used to expand processing options, then the processing versatility is improved, but the adhesive strength deteriorates
Solution Approach 1:
The patent changes the thermal conductivity parameter of the mounting table by adjusting coolant flow rate, which enables extended temperature control range including higher temperatures that would normally exceed adhesive limits, thus expanding processing options while the adhesive strength is protected by the controlled thermal environment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables flexible control of substrate temperatures within the extended range, allowing for precise temperature management during processing without deteriorating adhesive strength or exceeding cooling capacity limits, thus enhancing the apparatus's temperature control capabilities.
Implementation Method 1
a chiller (cooling unit) 99, which cools a coolant 80
Implementation Method 2
a pump 99a for circulating the coolant 80
Implementation Method 3
a flow rate control valve 98 for controlling a flow rate of the coolant 80 flowing through the bypass channel 96
Implementation Method 4
one or more heaters 91a to 91c disposed inside the electrostatic chuck 50 or at a bottom surface thereof
Implementation Method 5
a coolant channel 15 having an entrance 15a and an exit 15b... the first channel 94 connecting the chiller 99 and the entrance 15a and the second channel 95 connecting the chiller 99 and the exit 15b
Data Source
AI summary
A method which changes the temperature control range of a heater of a substrate processing apparatus. The temperature control range of a heater is changed or extended by changing the flow rate of the coolant flowing through a coolant channel from a first flow rate to a second flow rate which is smaller than the first flow rate, to change a first thermal conductivity of a mounting table to a second thermal conductivity which is smaller than the first thermal conductivity. The upper limit of the temperature control range is lower than the heat resistant temperature of a material of an adhesive of the mounting table.