Coolant Flow Monitoring in Power Modules Using Temperature Difference
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Solution Overview
Problem
Existing cooling systems for power semiconductor modules, particularly in aircraft, lack effective monitoring methods to ensure proper coolant flow, relying on temperature-sensitive devices that only provide temperature measurements without indicating if the coolant flow is within the designed range, necessitating additional flow sensors for accurate monitoring.
Innovation Solution
Implementing multiple integrated temperature sensors along the coolant flow path to measure and compare actual temperature differences with expected values based on module losses and nominal flow conditions, determining the coolant flow status without the need for separate flow sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature-sensitive devices are used to measure temperature, then temperature measurement is achieved, but coolant flow status cannot be determined
Solution Approach 1:
The temperature sensors perform dual functions: measuring temperature (original function) and determining coolant flow status (additional function). By using the temperature difference information already captured by the sensors for both purposes, the patent eliminates the need for separate flow sensors, thereby determining flow status without additional measurement devices.
2Measurement precision
If separate flow sensors are added to determine coolant flow status, then flow monitoring accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The existing temperature sensors are made multi-functional by using their measurements for both temperature monitoring and flow status determination. This eliminates the need to add separate flow sensors, maintaining monitoring accuracy while avoiding increased device complexity.
Solution Approach 2:
The patent combines the temperature measurement function and flow status detection function into a single integrated approach using the same sensor infrastructure. The temperature difference data is merged to infer flow conditions, consolidating multiple monitoring objectives into one unified system.
3Adaptability or versatility
If multiple temperature sensors are integrated along the coolant flow path, then flow monitoring capability is enhanced, but manufacturing complexity increases
Solution Approach 1:
The integrated temperature sensors serve dual purposes: standard temperature monitoring and coolant flow status determination. This multi-functionality enhances flow monitoring capability without requiring additional specialized components, thereby avoiding increased manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances coolant flow monitoring by integrating temperature sensors to assess flow status, reducing the need for additional sensors, saving space and cost while maintaining monitoring quality, and ensuring redundancy in aircraft applications.
Implementation Method 1
providing several temperature sensors arranged along the coolant flow path, measuring temperatures at different locations of the coolant flow path by means of the temperature sensors
Implementation Method 2
the cooling system configured to generate a coolant flow along a coolant flow path over the at least one semiconductor power module
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to a method for monitoring a cooling system for power electronics, especially on aircraft. For improving monitoring of a cooling system (18) of a power electronic semiconductor device (14), wherein the cooling system (18) is configured to generate a coolant flow (28, 28.1-28.4) along a coolant flow path over at least one semiconductor power module (20.1-20.3) of the power electronic semiconductor device, the invention proposes a method with the steps: a) providing several temperature sensors (22.1-22.3) arranged along the coolant flow path, b) measuring temperatures at different locations of the coolant flow path by means of the temperature sensors (22.1-22.3), c) comparing an actual temperature difference between the temperatures measured in step b) with an expected temperature difference calculated on basis of losses of the at least one semiconductor power module (20.1-20.3) and on basis of nominal coolant flow conditions; d) determining the status of the coolant flow on basis of the comparison of step c).