Coolant Liquid Manifold for IT Equipment Cooling

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Solution Overview

Problem

Existing IT enclosures face challenges with discrete cold plate loops that require numerous connections to a rack-level cooling manifold, leading to increased complexity and space requirements as more components need cooling, limiting efficiency and scalability.

Innovation Solution

A modular IT enclosure design incorporating a coolant liquid manifold with quick disconnect fittings and a fluid splitter to distribute and manage cooling fluid efficiently across multiple cold plates, reducing the need for discrete loops and simplifying assembly and servicing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If discrete cold plate loops are used to cool IT components, then each component can be cooled individually, but the number of connections to the rack-level cooling manifold increases significantly, leading to increased system complexity and space requirements

Engineering Contradiction:

Improveindividual component cooling capabilityVSAvoidnumber of connections to cooling manifold

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple discrete cold plate loops into a single integrated manifold assembly where multiple cold plates share common fluid distribution pathways. This merging reduces the total number of connections required at the rack-level cooling manifold while maintaining individual cooling capability for each IT component.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The manifold assembly is designed as a universal interface that can accommodate multiple different cold plates serving various IT components (processors, GPUs, storage devices) through standardized connection points. This multi-functional design allows a single manifold structure to handle cooling for diverse components without requiring separate dedicated connections for each.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If discrete cold plate loops with multiple connections are implemented, then comprehensive cooling coverage is achieved, but the space requirements within the IT enclosure increase

Engineering Contradiction:

Improvecooling coverageVSAvoidspace requirements in enclosure

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The manifold assembly is designed with a compact nested structure where fluid distribution channels are integrated within the manifold body itself rather than requiring separate external tubing for each connection. This nesting approach consolidates the cooling infrastructure into a space-efficient configuration that maintains comprehensive cooling coverage while minimizing the volume occupied within the IT enclosure.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Adaptability or versatility

If numerous discrete connections are made to the rack-level cooling manifold, then each component receives dedicated cooling, but assembly and servicing become more difficult

Engineering Contradiction:

Improvededicated cooling for each componentVSAvoidassembly and servicing difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The cooling system is segmented into modular components where the manifold assembly serves as a self-contained unit with integrated cold plates. This segmentation allows the entire manifold assembly to be pre-assembled and tested as a single module, then installed as one unit rather than requiring assembly of numerous individual connections, significantly easing both manufacturing and servicing operations.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The coolant liquid manifold enables flexible and efficient distribution of cooling fluid to various IT components, reducing complexity, minimizing space requirements, and enhancing scalability by consolidating connections and allowing for tailored fluid flow to each component.

Implementation Method 1

a chilled fluid is passed through conduits internal to the cold plate to remove heat from that component

Methodology Applied

Scientific EffectHeat transfer: Convection

Data Source

PatentUS12185496B2Liquid cooling manifold for information technology equipment

Publication Date: 2024.12.31 DELL PROD LP

AI summary

An information technology equipment enclosure comprises a plurality of IT components, cold plates disposed over at least two of the IT components, and a cooling fluid manifold disposed within the IT equipment enclosure. The coolant liquid manifold has multiple input connectors and multiple output connectors. Each of the cold plates are coupled to the cooling fluid manifold using a coolant line attached to one of the input connectors and a coolant line attached to one of the output connectors. An input cooling liquid line couples the coolant liquid manifold to an output of an external liquid cooling system, and an output liquid line couples the coolant liquid manifold to an input of the external liquid cooling system. The coolant liquid manifold is configured to receive cooling fluid from the external liquid cooling system and to distribute the cooling fluid to all of the cold plates via the input connectors.