Coolant Distribution Unit with Parallel Flow Paths for Low Pressure Drop
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Solution Overview
Problem
The increasing power density and operating frequencies in electronic components lead to heat management challenges, as traditional air cooling methods are inadequate for efficiently removing heat from high-power density devices, necessitating the development of more effective cooling systems for data centers and electronic systems.
Innovation Solution
A high-density liquid cooling system with a coolant distribution unit (CDU) that includes parallel flow paths, featuring primary and secondary loop piping with pumps, filters, and shutoff valves, along with a liquid-to-liquid heat exchanger, to efficiently transfer heat from electrical components to a primary coolant loop, thereby enhancing cooling capacity and reducing pressure drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling methods are used, then the system is simple to implement, but the cooling capacity is insufficient for high-power density electronic components
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by implementing a coolant distribution unit with primary and secondary loops. The hydraulic system uses pumps to circulate coolant through manifolds and channels that directly contact electronic components, enabling efficient heat removal from high-power density devices that cannot be cooled by air alone.
Solution Approach 2:
The cooling system is divided into multiple independent flow paths within the coolant distribution unit. Each flow path includes dedicated manifolds, channels, and coolant circuits that can be independently controlled and optimized. This segmentation allows the system to handle high heat loads from different components simultaneously while maintaining flexibility for future expansion.
2Reliability
If a single flow path is used in the coolant distribution unit, then the system is simpler, but the reliability decreases when maintenance or failures occur
Solution Approach 1:
The coolant distribution unit incorporates multiple independent flow paths with separate pumps, manifolds, and coolant circuits. This segmentation allows one path to be taken offline for maintenance or repair while others continue operating, ensuring continuous cooling and high system availability without requiring complete system shutdown.
Solution Approach 2:
Each flow path is equipped with local control elements including individual pumps, valves, and filtration systems. This localized design enables independent maintenance and troubleshooting of specific paths without affecting the entire cooling system, thereby maintaining overall reliability while managing complexity through modular architecture.
3Productivity
If high power density components are packed closer together, then the computing capacity increases, but the heat flux and cooling demands increase
Solution Approach 1:
The patent implements a liquid cooling system with coolant distribution units that directly contact high-power density electronic components through channels and manifolds. This hydraulic cooling approach efficiently removes the intense heat flux generated by closely packed components, enabling higher computing capacity without thermal overload that would occur with air cooling.
Solution Approach 2:
The cooling system transitions from surface-level air cooling to immersive liquid cooling where coolant flows through channels in direct contact with component surfaces. This dimensional change in heat transfer approach dramatically increases cooling efficiency, allowing much higher power densities and computing capacities to be sustained without excessive heat flux problems.
4Temperature
If coolant flow rate is increased to improve cooling capacity, then the temperature control improves, but the pressure drop increases
Solution Approach 1:
The coolant distribution unit divides the total coolant flow into multiple independent paths, each handling a portion of the total heat load. This segmentation allows each individual path to operate at lower flow rates and pressure drops while collectively providing the cooling capacity needed for high-power density components, avoiding the excessive pressure drops that would result from increasing flow in a single path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat in high-density electronic systems by providing improved cooling capacity and reduced pressure drop, enabling increased uptime and productivity while minimizing power consumption and maintenance downtime.
Implementation Method 1
CDUs typically include a liquid to liquid heat exchanger, which allows heat transfer from coolant in a secondary loop to a primary loop
Data Source
AI summary
Embodiments of the invention provide a system and method for providing parallel flow paths for a high density liquid cooling system. The system includes a coolant distribution unit including primary loop piping and secondary loop piping. The secondary loop piping includes a first flow path including a first pump, a first filter, and a first shutoff valve. The secondary loop piping includes a second flow path including a second pump, a second filter, and a second shutoff valve. The system includes an inlet y-pipe upstream of both of the first flow path and the second flow path and an outlet y-pipe downstream of both of the first flow path and the second flow path. Each of the first and second shutoff valves alternate between an open position and a closed position.