Cooled electronic system
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Solution Overview
Problem
Current cooling methods for electronic components, particularly in data processing centers, face inefficiencies due to high thermal resistance and the need for substantial energy consumption, often relying on air as a transfer medium which limits heat dissipation and increases operational costs.
Innovation Solution
A sealable module with a housing and heat transfer device featuring a conduction surface that conforms to the electronic component, allowing for efficient heat transfer between a first cooling liquid and a second cooling liquid, reducing thermal resistance and eliminating the need for vapor-cycle refrigeration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air is used as a transfer medium for heat dissipation, then the system structure is simple, but the heat transfer efficiency is insufficient and thermal resistance is high
Solution Approach 1:
The patent replaces air cooling with liquid cooling systems, using coolant fluids to transfer heat away from electronic components. The hydraulic cooling loops with pumps and heat exchangers provide superior heat transfer efficiency compared to air cooling, directly resolving the contradiction between structural simplicity and heat transfer performance.
Solution Approach 2:
The patent changes the physical state and properties of the cooling medium from gas (air) to liquid (coolant), fundamentally improving heat transfer capability. This parameter change allows the system to handle higher heat loads while maintaining reasonable structural complexity.
2Temperature
If vapor-cycle refrigeration is used to cool electronic components, then the cooling capability is sufficient, but the system complexity and energy consumption increase
Solution Approach 1:
The patent extracts and eliminates the vapor-cycle refrigeration system from the cooling architecture, replacing it with simpler liquid cooling methods. This removes the complexity of compressors, condensers, and expansion devices while maintaining adequate cooling capability through direct liquid-to-component heat transfer.
Solution Approach 2:
The patent introduces liquid coolant as an intermediary medium between the electronic components and the heat sink, providing efficient heat transfer without requiring complex phase-change refrigeration systems. The coolant acts as a mediator that simplifies the overall thermal management architecture.
3Device complexity
If air cooling is used to maintain temperature, then the system is simple, but substantial energy consumption is required
Solution Approach 1:
The patent transitions from air cooling to liquid cooling systems, where the higher specific heat capacity and thermal conductivity of liquids enable more efficient heat removal. This reduces the energy required for cooling operations while maintaining system feasibility through standardized hydraulic components.
Solution Approach 2:
The patent changes the cooling medium from air to liquid, fundamentally improving the energy efficiency of the cooling process. The liquid coolant's superior thermophysical properties allow for lower energy consumption in heat transfer operations.
4Temperature
If servers are distributed sparsely to improve air flow, then the thermal resistance is reduced, but the server density decreases
Solution Approach 1:
The patent implements liquid cooling systems that can effectively cool densely packed servers by delivering coolant directly to heat-generating components. This hydraulic cooling approach overcomes the air flow limitations that necessitate sparse server distribution, enabling high-density configurations while maintaining low thermal resistance.
Solution Approach 2:
The patent transitions from air-based convective cooling to liquid-based conductive and convective cooling, fundamentally changing the heat transfer dimensionality and efficiency. This allows for denser server configurations by providing superior heat removal capability that is not limited by air flow paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency, reduces energy consumption, and increases server density by maintaining the cooling liquid in a liquid state, thereby lowering operational costs and improving cooling system scalability.
Implementation Method 1
the conduction surface separating the volume and the channel to allow conduction of heat between the volume and the channel through the conduction surface
Implementation Method 2
A coolant liquid, preferably oil, is pumped through the container. The processor board is located at the bottom of the container and an evaporator coil is positioned at the top of the container, such that convection currents are produced in the coolant liquid.
Data Source
AI summary
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.