Actively Cooled Planar Coil Layout for Insulated Heat Removal
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Solution Overview
Problem
The challenge in coil systems with layered planar coils is the limited thermal conductivity due to large insulation gaps, which hampers heat removal in high-energy density applications, particularly in compact and lightweight designs like linear motors, where efficient heat dissipation is crucial.
Innovation Solution
The coil system employs a shingled arrangement of planar coils with a lateral offset, creating a comb-like structure for improved lateral heat transport, combined with a passive conductor track structure that is DC-isolated and thermally connected to the current-carrying windings, and incorporates a cooling channel for efficient heat dissipation using a liquid coolant, and an iron core to enhance magnetic flux density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If planar coils are arranged in layers with large insulation gaps, then electrical insulation is ensured, but thermal conductivity deteriorates
Solution Approach 1:
A passive conductor track structure is introduced as an intermediary element between the planar coils. This structure provides thermal conduction paths while maintaining electrical insulation through DC-isolation, effectively mediating between the conflicting requirements of electrical safety and thermal management
Solution Approach 2:
The solution transitions from purely lateral heat transport within layers to three-dimensional heat transport by utilizing vertical paths through the passive conductor track structure. This dimensional change allows heat to bypass the insulating gaps that block lateral heat flow
2Quantity of substance
If energy density is increased in multilayer boards, then compactness is improved, but heat removal capability deteriorates
Solution Approach 1:
The heat removal function is segmented from the current-carrying planar coils and assigned to a separate passive conductor track structure. This segmentation allows the coils to be densely packed for high energy density while the dedicated thermal management structure handles heat removal independently
Solution Approach 2:
The passive conductor track structure acts as a mediator that decouples the relationship between energy density and heat removal. It provides a thermal conduction network that operates independently from the electrical current paths, enabling high energy density without compromising heat removal capability
3Temperature
If lateral heat transport is improved through shingled arrangement, then thermal resistance is reduced, but device complexity increases
Solution Approach 1:
The passive conductor track structure serves multiple functions simultaneously: it provides thermal conduction paths, maintains electrical insulation, and offers mechanical support. This multi-functionality reduces the need for separate dedicated components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances thermal conductivity across layers, reduces thermal resistance, and allows for effective heat removal while maintaining electrical insulation, thereby increasing energy density and magnetic flux density in compact motor designs.
Implementation Method 1
incorporates a cooling channel for efficient heat dissipation using a liquid coolant
Implementation Method 2
an iron core to enhance magnetic flux density
Data Source
AI summary
A coil system, including: pairs of planar coils vertically stacked in a vertical direction, each pair of planar coils including a first planar coil including a first outer turn and a second planar coil including a second outer turn overlapping the first outer turn and laterally offset from the first outer turn; and pairs of vertically stacked thermal conductor tracks, each pair of thermal conductor tracks including a first track and a second track overlapping the first track, laterally offset from the first track, and overlapping the first outer turns of the pairs of planar coils. The pairs of thermal conductor tracks are DC isolated from pairs of planar coils. The first outer turns and the second outer turns of the pairs of planar coils form a first comb-like structure. The plurality of pairs of thermal conductor tracks form a second comb-like structure engaged with the first comb-like structure.