Cooled Power Conversion Assembly with Segmented Thermal Management

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Solution Overview

Problem

Existing power conversion assemblies are complex and require sophisticated cooling systems, which can be costly and inefficient.

Innovation Solution

The use of base-to-air cooling elements for high heat density devices and air-to-air cooling elements for low heat density devices within a cooled power conversion assembly, simplifying the cooling process and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid coolant circulation heat exchangers are used for cooling power conversion devices, then heat transfer efficiency is improved, but device complexity and cost increase

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is segmented into two distinct types: base-to-air cooling elements for high heat density devices and air-to-air cooling elements for low heat density devices. This segmentation allows each cooling type to be optimized for its specific application, avoiding the need for a complex liquid coolant system for all devices.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different cooling methods are applied to different locations based on heat density requirements. High heat density devices receive base-to-air cooling with direct thermal contact, while low heat density devices receive air-to-air cooling without direct contact. This local differentiation simplifies the overall system by matching cooling intensity to actual needs.

Inventive Principle:
Principle #3Local quality

2Reliability

If sophisticated cooling systems are used for power conversion assemblies, then cooling capability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvecooling capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs simpler, less expensive cooling elements that can be manufactured at lower cost. Base-to-air cooling elements use direct thermal contact without requiring complex liquid circulation infrastructure, and air-to-air cooling elements are even simpler in design, reducing manufacturing costs while maintaining adequate cooling capability.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The invention extracts and removes the complex liquid coolant circulation system from the cooling architecture. By replacing it with simpler base-to-air and air-to-air cooling elements, the patent eliminates pumps, liquid channels, and associated control systems, thereby reducing manufacturing cost while preserving cooling function.

Inventive Principle:
Principle #2Taking out (Extraction)

3Power

If liquid coolant circulation systems are used, then heat removal effectiveness is improved, but system simplicity is reduced

Engineering Contradiction:
Improveheat removal effectivenessVSAvoidcooling system simplicity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The cooling system is divided into two segments: base-to-air cooling for high heat density devices that requires direct thermal contact for effective heat removal, and air-to-air cooling for low heat density devices that uses convection without direct contact. This segmentation achieves effective heat removal without the complexity of liquid circulation systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces the mechanical liquid coolant circulation system with thermal conduction-based base-to-air cooling and convection-based air-to-air cooling. This substitution eliminates mechanical pumps, liquid flow control mechanisms, and associated complexity while maintaining heat removal effectiveness through passive or simpler active thermal transfer.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a simpler and more cost-effective cooling solution for power conversion assemblies, effectively managing heat transfer through conduction and convection methods without direct contact, enhancing efficiency and reducing complexity.

Implementation Method 1

Heat transfer between the first type device 1 and corresponding first cooling element 3 is adapted to take place through heat conduction

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

Heat transfer between the second type device 2 and corresponding second cooling element 4 is adapted to take place through heat convection

Methodology Applied
Scientific EffectHeat convection: Convection

Implementation Method 3

The cooling channel fan means 76 is adapted for providing a cooling channel cooling medium flow between the first end 641 of the cooling channel 64 and the second end 642 of the cooling channel 64

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentUS9974214B2Cooled power conversion assembly
Publication Date: 2018.05.15 MARICI HLDG THE NETHERLANDS BV
  • US9974214B2 patent drawing
  • US9974214B2 patent drawing
  • US9974214B2 patent drawing

AI summary

A cooled power conversion assembly comprising a first chamber, a second chamber at least partially separated from the first chamber, at least one first type device located in the first chamber, at least one second type device located in the second chamber, and cooling means comprising a first cooling element and a second cooling element. The first cooling element is adapted to transfer heat out of the first chamber, and the second cooling element is adapted to transfer heat out of the second chamber. The first cooling element is in direct contact with the at least one first type device, and the second cooling element is in a heat transfer connection with the at least one second type device through a gaseous cooling medium.