Cooled PVD Top Shield for Shadow Frame Protection
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Solution Overview
Problem
In physical vapor deposition (PVD) systems, material deposition on chamber components like shadow frames and susceptors leads to contamination of substrates due to flaking, which is exacerbated by temperature fluctuations during processing and downtime.
Innovation Solution
A top shield is introduced in the PVD chamber that remains stationary and is cooled to reduce deposition on the shadow frame, using a cooling manifold to control temperature and minimize flaking by partially shielding the shadow frame from sputtering material and maintaining a stable temperature environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the shadow frame is moved between lowered and raised positions during processing, then the susceptor edge can be shielded from deposition, but material deposits on the shadow frame and flakes off during temperature fluctuations, contaminating the substrate
Solution Approach 1:
A top shield is introduced as an intermediary component between the sputtering source and the shadow frame. This top shield intercepts sputtering material before it reaches the shadow frame, preventing deposition on the shadow frame surface and subsequent flaking that would contaminate the substrate.
Solution Approach 2:
The top shield is cooled to a controlled temperature to reduce temperature fluctuations during processing and downtime. This temperature stabilization prevents thermal expansion and contraction cycles that cause deposited material to flake off the shadow frame, thereby reducing substrate contamination.
2Reliability
If the top shield is cooled to reduce temperature fluxuation, then material flaking is reduced, but the device complexity increases with addition of cooling manifold
Solution Approach 1:
The top shield serves multiple functions: it shields the shadow frame from sputtering material deposition, acts as a temperature stabilization element through integrated cooling, and prevents flaking contamination. By combining these functions in a single component, the overall device complexity is minimized while achieving reliable process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The top shield effectively reduces material deposition on the shadow frame, minimizing substrate contamination and temperature-induced flaking, thereby enhancing the cleanliness and reliability of the PVD process.
Implementation Method 1
The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time
Implementation Method 2
The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing
Implementation Method 3
The sputtered atoms travel generally toward the substrate being sputter coated, and the sputtered atoms are deposited on the substrate
Implementation Method 4
ions generated in a process region can bombard the targyet surface with sufficient energy to dislodge atoms from the target. The process of biasing a target to cause the generation of a plasma that causes ions to bombard and remove atoms from the target surface is commonly called sputtering
Data Source
AI summary
The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.