Vehicle Computing Cooler Connector for Compact Sealed Cooling

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Solution Overview

Problem

Existing cooling systems for electronic computing devices in motor vehicles are inefficient and require complex, space-consuming, and costly connections for cooling medium flow, leading to overheating issues.

Innovation Solution

A cooling device with a connector having intrinsic threads for direct screwing to the housing and cooler, sealed in multiple planes to minimize structural space and parts, allowing efficient cooling medium flow through integrated cooling channels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a cooling device with separate housing and cooler components is used, then the electronic computing device can be cooled effectively, but the structural space requirements and part count increase

Engineering Contradiction:
Improvecooling effectivenessVSAvoidpart count
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The connector is designed with an integrated cooler component, merging what would traditionally be separate housing and cooling system components into a single integrated unit. This reduces the total part count while maintaining the cooling function through the integrated cooling channels and sealing elements.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If multiple sealing elements are used to seal the connector, then sealing reliability is improved, but structural space and weight increase

Engineering Contradiction:
Improvesealing reliabilityVSAvoidconnector weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

Multiple sealing functions are combined into a single integrated sealing element within the connector. This single element seals both the first cooling channel and the second cooling channel, eliminating the need for separate sealing components while maintaining reliable sealing across all interfaces.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If a dedicated thread is added to the connector for interconnection, then assembly precision and reliability are improved, but manufacturing complexity increases

Engineering Contradiction:
Improveassembly precisionVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The dedicated threading feature is integrated directly into the connector body during the same manufacturing process that forms the cooling channels and sealing elements. This approach adds the precision threading function without requiring separate manufacturing steps or additional assembly operations, thereby maintaining ease of manufacture while achieving high assembly precision.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective and efficient cooling of electronic computing devices, reducing overheating risks while minimizing structural space, weight, and costs, with simplified assembly and sealing.

Implementation Method 1

heat from the subregion can be transferred to the cooling medium flowing in particular through the first cooling channel, in particular via the cooler

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

the cooling medium can flow through the first cooling channel and the second cooling channel

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12610509B2Cooling device for cooling an electronic computing device for a motor vehicle, and motor vehicle
Publication Date: 2026.04.21 BAYERISCHE MOTOREN WERKE AG
  • US12610509B2 patent drawing
  • US12610509B2 patent drawing

AI summary

A cooling device includes an electronic computing device where the electronic computing device has a housing with a receiving space and an electronic component disposed in the receiving space. A cooler is formed separately from the housing where the cooler is disposed at least partially in the receiving space, is connected to the housing, and has a first cooling channel which is disposed at least partially in the receiving space and through which a cooling medium is flowable for cooling a subregion of the electronic computing device. A connector is formed separately from the housing and separately from the cooler, where the connector has a second cooling channel through which the cooling medium is flowable and which is fluidically connected to the first cooling channel.