Electronic Component Cooler With Flow Path Protrusions

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing electronic component coolers do not effectively improve the velocity distribution in the refrigerant introduction flow path, which limits their cooling efficiency.

Innovation Solution

The cooler design includes protruding portions within the refrigerant introduction flow path and pipe, which constrict the flow area, creating a higher velocity distribution that enhances cooling efficiency by increasing the refrigerant's velocity as it approaches the cooling fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the refrigerant flow path area is increased to improve refrigerant flow, then the cooling coverage is improved, but the refrigerant velocity decreases reducing cooling efficiency

Engineering Contradiction:
Improverefrigerant flow path areaVSAvoidrefrigerant velocity
Core Design Contradiction:
Area of stationary objectVSSpeed

Solution Approach 1:

The patent applies local quality by creating a protruding portion at a specific location within the refrigerant flow path. This protruding portion locally reduces the flow path area only in the introduction region, while maintaining a larger overall flow path area. This localized area reduction increases refrigerant velocity where needed (near the cooling fins) without sacrificing the overall cooling coverage provided by the larger flow path area.

Inventive Principle:
Principle #3Local quality

2Speed

If the refrigerant flow path area is constricted to increase refrigerant velocity, then cooling efficiency is improved, but the refrigerant flow rate decreases reducing cooling coverage

Engineering Contradiction:
Improverefrigerant velocityVSAvoidrefrigerant flow rate
Core Design Contradiction:
SpeedVSQuantity of substance

Solution Approach 1:

The protruding portion creates a localized constriction only in the refrigerant introduction region, not throughout the entire flow path. This allows velocity increase in the critical cooling zone while maintaining adequate flow rate overall. The constriction is spatially limited rather than applying to the entire flow path, preserving the balance between velocity and flow rate.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces a dimensional variation in the flow path cross-section by adding the protruding portion. This creates a three-dimensional flow path geometry where the area varies along the flow direction, allowing velocity enhancement in specific regions without uniformly reducing the flow rate throughout the entire system.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves the cooling efficiency of electronic components by increasing the refrigerant's velocity near the cooling surface, effectively reducing hot spots and enhancing the overall cooling effect.

Implementation Method 1

a flow path sectional area in the place in which the first protruding portion is provided is smaller than those before and after the first protruding portion

Methodology Applied
Scientific EffectVenturi effect: Venturi Effect

Implementation Method 2

a plurality of cooling fins, provided in an intermediate portion of an inner wall of the first wall portion, that divide the refrigerant flow path

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a first wall portion of which an outer wall surface forms a cooling surface that cools an electronic component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9991188B2Electronic component cooler
Publication Date: 2018.06.05 FUJI ELECTRIC CO LTD
  • US9991188B2 patent drawing
  • US9991188B2 patent drawing
  • US9991188B2 patent drawing

AI summary

A cooler with a cooler main body that, in one configuration, includes a first wall portion forming a cooling surface that cools an electronic component, a second wall portion disposed opposing the first wall portion, and a side wall portion that connects a periphery of the first wall portion and a periphery of the second wall portion. In the configuration, cooling fins are attached to an inner wall surface of the first wall portion, a refrigerant introduction pipe and refrigerant introduction flow path for supplying refrigerant to the cooling fins and a refrigerant discharge pipe and refrigerant discharge flow path for ejecting refrigerant from the cooling fins are included, and protruding portions and are provided on the first wall portion side of the refrigerant introduction flow path.