Integrated Cooler Header With C-L-C Wire-Bond Impedance Matching
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Solution Overview
Problem
Existing electronic component packages face challenges in achieving effective thermal decoupling and low signal reflection at connection points, particularly in radio frequency data transfer applications, due to the limited space and high conduction losses associated with thermoelectric coolers and bonding wire connections.
Innovation Solution
A header design incorporating a thermoelectric cooler with a C-L-C network, where capacitive structural features at the ends of conductor track arrangements create a C-L-C network to compensate for the high impedance of bonding wire connections, thereby achieving impedance matching and reducing heat flow between the hot and cold sides while minimizing signal reflections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If bonding wire connections are used to electrically connect the electronic device in the package, then the electrical connection is simple and compact, but considerable conduction losses occur at high data transfer rates
Solution Approach 1:
The patent introduces an intermediary C-L-C network (capacitor-inductor-capacitor compensation network) between the bonding wire connections to compensate for their high impedance. This network acts as a mediator that cancels out the adverse effects of the bonding wires' inductance and resistance, enabling high-speed data transfer with minimal signal degradation while maintaining the simplicity of wire bonding connections.
2Temperature
If a thermoelectric cooler is integrated into the package for effective cooling, then temperature stabilization is improved, but thermal decoupling between hot and cold sides becomes difficult to achieve
Solution Approach 1:
The patent segments the thermal path by introducing a thermally isolating structure that divides the package into distinct hot and cold zones. This segmentation allows the thermoelectric cooler to effectively pump heat from the cold side (electronic device) to the hot side (heat sink) without significant thermal back-flow, improving temperature stabilization while reducing energy waste from thermal short-circuits.
3Volume of stationary object
If simple bonding wire connections are used, then the package structure remains compact, but signal reflections increase due to high impedance
Solution Approach 1:
The C-L-C compensation network serves as an intermediary that actively counteracts the high impedance and signal reflections inherent in bonding wire connections. By placing capacitors and inductors strategically around the wire bonds, the network creates an impedance-matched pathway for high-frequency signals, eliminating reflections without requiring a complete redesign of the compact package structure.
4Productivity
If the data transfer rate is doubled to 56 GBit/s for next generation optical data links, then transmission capacity is improved, but conduction losses in existing connections become unacceptable
Solution Approach 1:
The patent changes the electrical parameters of the connection pathway by introducing the C-L-C compensation network, which modifies the impedance characteristics to be suitable for 56 GBit/s data rates. This parameter transformation allows existing bonding wire connections to support next-generation high-speed optical data links by compensating for frequency-dependent losses and maintaining signal integrity at doubled transfer rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The C-L-C network effectively compensates for the high impedance of bonding wire connections, reducing signal reflections and conduction losses, enabling improved thermal decoupling and radio frequency transmission with minimal attenuation, suitable for high-speed data transfer rates up to 56 GBit/s.
Implementation Method 1
a thermoelectric cooler (16) is attached to the base body (3) in such a manner that the thermoelectric cooler (16) is able to give off its waste heat generated during operation to the base body (3)
Implementation Method 2
at least one of the ends of the conductor track arrangements (11, 12) are facing each other at the gap (20) include a capacitive structural feature (111, 121) that increases the capacitance of the conductor track arrangement (11, 12)
Implementation Method 3
The gap (20) is bridged by bonding wire connections (22) connecting the two signal conductors (13, 15) and the grounding conductors (14)
Data Source
AI summary
A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.