Cooler-Housing Contact Layout for EMC-Stable Power Electronics

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Solution Overview

Problem

Electronic arrangements with power components face challenges in achieving optimal electromagnetic compatibility and cooling while preventing interference voltages and capacitive couplings, particularly during switching operations.

Innovation Solution

An electronic arrangement featuring a liquid cooler with a contact element that provides an electrically conductive connection between the cooler and housing, ensuring equalization of electrical potentials and mechanical stability, thereby preventing potential differences that could lead to electromagnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a cooler is used to cool electronic components, then cooling efficiency is improved, but electrical potential differences and electromagnetic interference may arise between the cooler and housing

Engineering Contradiction:
Improvecooling efficiencyVSAvoidelectromagnetic interference
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies the equipotentiality principle by providing an electrically conductive connection between the cooler and the housing. This equalizes the electrical potentials of both components, preventing potential differences that would otherwise cause electromagnetic interference and capacitive couplings during switching operations. The conductive connection ensures both components operate at the same electrical potential while maintaining their cooling function.

Inventive Principle:
Principle #12Equipotentiality

2Temperature

If the cooler is made of metal for efficient heat dissipation, then cooling performance is improved, but electromagnetic radiation and potential differences increase

Engineering Contradiction:
Improveheat dissipationVSAvoidelectromagnetic radiation
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful electromagnetic radiation issue into a benefit by using the metal cooler's electrical conductivity to its advantage. Instead of treating the metal's conductivity as solely a source of interference, the invention utilizes it to create an equipotential connection with the housing, thereby eliminating potential differences and their associated harmful effects while maintaining efficient heat dissipation.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Object-affected harmful factors

If shielding is used to protect from electromagnetic radiation, then electromagnetic compatibility is improved, but device complexity increases

Engineering Contradiction:
Improveelectromagnetic protectionVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent applies the universality principle by making the housing serve multiple functions: it provides mechanical protection for the electronic components and simultaneously acts as an electromagnetic shield and an electrical reference potential. By integrating these functions into the existing housing structure rather than adding separate shielding components, the solution avoids increasing device complexity while achieving electromagnetic compatibility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prevents electromagnetic interference and ensures efficient cooling by maintaining stable electrical potentials and mechanical alignment, allowing for reliable operation and cost-effective design.

Implementation Method 1

a cooling liquid flows through it in order to thereby be able to dissipate heat particularly efficiently from the electronic component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

cooling liquid flows through it in order to thereby be able to dissipate heat particularly efficiently from the electronic component

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

The contact element interconnects the cooler and the housing in an electrically conductive manner... a particularly direct and reliable equalization of electrical potentials of the cooler and housing can occur in the area of the coolant connection

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20240381594A1Electronic arrangement
Publication Date: 2024.11.14 ROBERT BOSCH GMBH
  • US20240381594A1 patent drawing
  • US20240381594A1 patent drawing
  • US20240381594A1 patent drawing

AI summary

The invention relates to an electronic arrangement (1), comprising: an electronic component (2), a cooler (3) for cooling the electronic component (2), a housing (4), and a contact element (5), wherein: the electronic component (2) and the cooler (3) are arranged within the housing (4); the cooler (3) has at least one coolant connection (31) which protrudes through a through-opening (41) in the housing (4); the contact element (5) interconnects the cooler (3) and the housing (4) in an electrically conductive manner, and the contact element (5) is designed and arranged concentrically with the through-opening (41).