Cooling Assembly Baffle Layout for Uniform CPO Liquid Cooling
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Solution Overview
Problem
The challenge of efficiently cooling Co-Packaged Optics (CPO) devices with liquid cooling methods to manage increasing heat dissipation demands in high-density chip switching systems is unresolved.
Innovation Solution
A cooling assembly is designed with baffles and flow guide through holes to control the flow of cooling medium, ensuring uniform heat dissipation by distributing the cooling medium through multiple flow guide through holes based on the power requirements of communication function modules, and utilizing a housing with specific medium cavities for controlled inflow and outflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid cooling method is adopted to cool CPO devices, then heat dissipation efficiency is improved, but cooling uniformity and flow control become difficult to achieve
Solution Approach 1:
The housing internal space is segmented into multiple medium cavities (first medium cavity, second medium cavity, third medium cavity) by baffles. Each cavity is equipped with independent flow guide through holes, allowing separate control of cooling medium flow in different regions. This segmentation enables differentiated cooling for different functional modules, achieving uniform cooling while maintaining high heat dissipation efficiency.
2Productivity
If multiple communication function modules are integrated in high-density system, then switching capacity is improved, but heat dissipation demand increases
Solution Approach 1:
Different regions of the housing are provided with different numbers and distributions of flow guide through holes in the baffles. The first baffle has a first number of flow guide through holes, the second baffle has a second number, and the third baffle has a third number. This local differentiation allows cooling resources to be concentrated where heat generation is highest, matching cooling capacity to local heat dissipation demands of different communication function modules.
3Loss of energy
If cooling medium flow is increased to meet heat dissipation demand, then heat dissipation efficiency is improved, but risk of backflow and cooling effectiveness reduction increases
Solution Approach 1:
The patent designs the flow path and flow guide through holes to prevent backflow before it can occur. The cooling medium flows sequentially through multiple cavities in a predetermined direction, with the flow guide through holes positioned and sized to maintain forward flow momentum. This preliminary anti-action against backflow ensures stable cooling effectiveness even at high flow rates required for meeting heat dissipation demands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures effective cooling of communication function modules by controlling the flow direction of the cooling medium, preventing backflow, and optimizing heat dissipation efficiency.
Implementation Method 1
a plurality of first flow guide through holes being formed in the first baffle, so as to communicate the first medium cavity with the module accommodating cavity; and a plurality of second flow guide through holes being formed in the second baffle, so as to communicate the second medium cavity with the module accommodating cavity
Implementation Method 2
a cooling assembly is designed with baffles and flow guide through holes to control the flow of cooling medium, ensuring uniform heat dissipation by distributing the cooling medium through multiple flow guide through holes
Data Source
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AI summary
Provided in the present disclosure is a cooling assembly. The cooling assembly comprises a shell, a first spoiler and a second spoiler, wherein the first spoiler and the second spoiler are both arranged in the shell, and divide an internal space of the shell into a first medium cavity, a module accommodating cavity and a second medium cavity, the first spoiler is arranged between the first medium cavity and the module accommodating cavity, and the second spoiler is arranged between the second medium cavity and the module accommodating cavity; a first medium through hole in communication with the first medium cavity is formed in the shell, and a second medium through hole in communication with the second medium cavity is formed in the shell; a plurality of first flow guide through holes are formed in the first spoiler so as to enable the first medium cavity to be in communication with the module accommodating cavity; and a plurality of second flow guide through holes are formed in the second spoiler so as to enable the second medium cavity to be in communication with the module accommodating cavity. Further provided in the present disclosure is a communication device.