Cooling Assembly Dampened Oscillation Response
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Solution Overview
Problem
High-performance data center computing systems face challenges with increased heat dissipation and I/O counts, leading to packaging issues such as chip packages 'popping out' of sockets and potential damage from mechanical shock due to heavier heat sinks, which require stronger assembly loading forces but result in oscillations that damage I/O connections.
Innovation Solution
Incorporating damping elements made of viscous materials, such as rubber or sorbothane, in parallel with spring elements to reduce oscillations and maintain static loading forces, thereby minimizing damage to I/O connections during mechanical shocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stronger assembly loading forces are applied to prevent chip packages from popping out and to support heavier heat sinks, then reliability of chip package retention is improved, but oscillations during mechanical shock increase causing damage to I/O connections
Solution Approach 1:
The patent applies beforehand cushioning by introducing damping elements (viscoelastic materials, foam, rubber, or spring-based dampers) between the heat sink and bolster plate that are pre-configured to absorb and dissipate oscillation energy during mechanical shock events, preventing the oscillations from reaching and damaging the I/O connections while maintaining the necessary assembly loading forces for chip package retention
2Temperature
If heavier heat sinks are used to increase thermal mass and cooling capacity, then heat dissipation performance is improved, but mechanical shock resistance deteriorates due to increased momentum and oscillation
Solution Approach 1:
The damping elements are installed in advance between the heat sink and bolster plate to provide shock absorption during mechanical shock events, allowing the system to tolerate heavier heat sinks for improved heat dissipation while protecting against the increased oscillation forces that would otherwise damage I/O connections
3Force
If increased loading forces are applied to the chip package assembly, then resistance to pop-off is improved, but mechanical shock-induced oscillations are amplified causing I/O connection damage
Solution Approach 1:
The damping elements are pre-installed in the assembly path between the heat sink and bolster plate to intercept and dissipate oscillation energy before it can propagate to the I/O connections, allowing the full assembly loading force to be applied for pop-off resistance without the harmful oscillation amplification effect
Solution Approach 2:
The damping elements act as an intermediary component between the heat sink and bolster plate, decoupling the static loading force transmission (which prevents pop-off) from the dynamic oscillation transmission (which causes I/O damage), allowing both high loading forces and shock resistance to coexist
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of damping elements significantly reduces the amplitude of oscillations, resulting in fewer damaging movements and increased durability of I/O connections, effectively addressing the challenges of increased heat dissipation and I/O counts in high-performance data center computing systems.
Implementation Method 1
Incorporating damping elements made of viscous materials, such as rubber or sorbothane, in parallel with spring elements to reduce oscillations
Data Source
Figure 1a~1b
Figure 1c
Figure 1d~1e
AI summary
An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.