External Cooling Assembly with Dry Disconnect for Thermal Management

Solution Overview

Problem

Electronic devices face challenges in balancing power density, spatial layout, temperature requirements, and acoustic noise due to limitations in air and liquid cooling systems, where air cooling increases electrical power and acoustic noise, and liquid cooling risks leakage within the device.

Innovation Solution

An assembly for a cooling system that includes a support member, a channel, and a fluid control mechanism, where heat is transferred from the electronic device to a thermal member via a dry disconnect, allowing liquid cooling to occur outside the device, reducing leakage risks and enhancing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air cooling systems are used, then acoustic noise is generated, but electrical power consumption increases

Engineering Contradiction:

Improvecooling effectivenessVSAvoidelectrical power consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The liquid cooling system extracts the cooling function from the electronic device itself and relocates it to an external cooling assembly. The thermal member receives heat from the electronic device via a dry disconnect interface, while the fluid cooling mechanism operates outside the device boundaries, separating the heat generation zone from the fluid circulation zone and eliminating leakage risks.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

A thermal member acts as an intermediary between the electronic device and the liquid cooling system. It receives heat from the device through a dry disconnect interface and transfers it to the fluid circulating in the cooling assembly, enabling efficient heat transfer without direct fluid contact with the device interior.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If liquid cooling systems are used within the electronic device, then cooling efficiency improves, but the risk of fluid leakage increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidleakage risk

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The liquid cooling system extracts the cooling function from the electronic device itself and relocates it to an external cooling assembly. The thermal member receives heat from the electronic device via a dry disconnect interface, while the fluid cooling mechanism operates outside the device boundaries, separating the heat generation zone from the fluid circulation zone and eliminating leakage risks.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

A thermal member acts as an intermediary between the electronic device and the liquid cooling system. It receives heat from the device through a dry disconnect interface and transfers it to the fluid circulating in the cooling assembly, enabling efficient heat transfer without direct fluid contact with the device interior.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If conventional cooling systems are used, then temperature control is achieved, but spatial layout and power density are compromised

Engineering Contradiction:

Improvetemperature controlVSAvoidspatial layout complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is segmented into distinct functional modules: a thermal member that interfaces with the electronic device, a cooling assembly containing the fluid circulation system, and a dry disconnect interface. This modular segmentation allows each component to be optimized independently and simplifies the overall spatial layout by separating cooling functions from device internals.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides efficient liquid cooling while minimizing the risk of fluid leakage within the electronic device, balancing power density and spatial layout, and reducing acoustic noise, thus effectively managing temperature requirements.

Implementation Method 1

The heat from the electronic device transfers to the thermal member via a dry disconnect. The heat is transferred from the electronic device to the thermal member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Fluid that contacts the thermal member removes the heat from the thermal member and the fluid is removed from the assembly via the channels

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10571206B2Cooling assembly

Publication Date: 2020.02.25 HEWLETT PACKARD ENTERPRISE DEV LP

AI summary

An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.