Cooling Base Plate Thermal Segmentation for Compact Substrate Treating Apparatus
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Solution Overview
Problem
Current substrate treating apparatuses face challenges in reducing footprint and height due to heat-induced breakdowns of drive mechanisms, especially at higher temperatures, which complicates the arrangement of these mechanisms inside the casing.
Innovation Solution
The implementation of a cooling base plate that separates heat from the heat treating plate, allowing the lift pin and shutter body drive mechanisms to be positioned inside the casing without large gaps, thereby reducing the apparatus's footprint and height by suppressing heat transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the drive mechanism is disposed inside of the casing, then the footprint of the apparatus is reduced, but the drive mechanism may suffer breakdown due to heat from the heat treating plate
Solution Approach 1:
The base plate is divided into a heat-resistant portion and a cooling portion, separating the thermal zones to allow the drive mechanism to operate in a cooled environment while the heat treating plate maintains high temperature for substrate processing
Solution Approach 2:
The cooling base plate acts as an intermediary between the heat treating plate and the drive mechanism, blocking heat transmission to the drive mechanism while allowing it to be positioned inside the casing, thus reducing footprint without compromising reliability
2Reliability
If the drive mechanism is disposed at a position spaced away from the heat treating plate largely downwardly to suppress heat influence, then the heat influence on the drive mechanism is reduced, but the apparatus becomes extremely high
Solution Approach 1:
Instead of spacing the drive mechanism vertically downwardly from the heat treating plate, the cooling base plate enables horizontal integration by creating a thermally isolated zone within the base plate itself, allowing the drive mechanism to be positioned inside the casing without excessive height
3Manufacturing precision
If heat treatment at higher temperatures of 300 to 500° C. is performed to form an underlayer film, then the quality of the underlayer film is improved, but the drive mechanism may suffer breakdown by heat influence with a highly increased possibility
Solution Approach 1:
The base plate is segmented into heat-resistant and cooling portions, creating distinct thermal zones that allow high-temperature heat treatment for quality underlayer film formation while simultaneously protecting the drive mechanism from heat-induced breakdown
Solution Approach 2:
The cooling base plate serves as a thermal barrier between the high-temperature heat treating plate and the drive mechanism, enabling high-temperature processing for improved manufacturing precision without compromising drive mechanism reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents heat-induced failures of drive mechanisms, enabling them to be placed inside the casing without increasing the apparatus's height, resulting in a more compact and reliable substrate treating system.
Implementation Method 1
a cooling base plate above which the heat treating plate is placed to suppress transmission of heat from the heat treating plate downwardly
Data Source
AI summary
Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate that heats the substrate; lift pins that deliver the substrate, a lift pin drive mechanism that causes the lift pins to move upwardly/downwardly; a casing that produces a heat treatment atmosphere; and a cooling base plate that suppresses transmission of heat from the heat treating plate. The lift pin drive mechanism is disposed below the cooling base plate.