Cooling Block Channel Geometry for Turbulent Heat Dissipation

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Solution Overview

Problem

Existing cooling blocks for heat-generating electronic components are often inefficient and costly to manufacture, as they rely on conventional designs that do not effectively promote turbulent flow to enhance heat absorption.

Innovation Solution

A cooling block design featuring a fluid conduit with scalloped internal sidewalls and pin rows that create a catenulate shape, promoting turbulent flow by deflecting the cooling fluid and increasing heat absorption efficiency, manufactured using sinusoidal splines to form the passages and pin rows.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional cooling block designs are used, then manufacturing is simpler, but heat absorption efficiency is insufficient due to lack of turbulent flow promotion

Engineering Contradiction:
Improveheat absorption efficiencyVSAvoidfluid conduit structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies curvature by designing scalloped internal sidewalls with rounded sections instead of straight lines, and incorporates pin rows that create a catenulate (chain-like) shape in the fluid conduit. These curved and undulating structures promote turbulent flow of cooling fluid, enhancing heat absorption efficiency from the electronic component while maintaining manufacturability through defined geometric patterns.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If complex fluid conduit structures with turbulent flow promotion features are implemented, then heat absorption efficiency improves, but manufacturing cost and difficulty increase

Engineering Contradiction:
Improveheat absorption efficiencyVSAvoidmanufacturing cost and difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the fluid conduit into distinct functional elements: scalloped internal sidewalls with rounded sections, pin rows arranged in specific patterns, and defined passage geometries. This segmentation allows each feature to be designed and manufactured independently using standardized processes, reducing overall manufacturing complexity while achieving turbulent flow promotion for enhanced heat absorption.

Inventive Principle:
Principle #1Segmentation

3Productivity

If cooling fluid flow is increased to enhance heat dissipation, then heat absorption improves, but flow separation and recirculation occur reducing efficiency

Engineering Contradiction:
Improveheat dissipation rateVSAvoidenergy loss due to flow separation and recirculation
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent employs the pin rows and scalloped sidewalls to create controlled disturbances in the cooling fluid flow, effectively inducing mechanical vibration and turbulence. This controlled turbulence enhances heat transfer coefficients and prevents stagnant zones and recirculation patterns, ensuring efficient heat dissipation without energy-wasting flow separation while maintaining stable operating conditions.

Inventive Principle:
Principle #18Mechanical vibration

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heat absorption capabilities by limiting flow separation and recirculation, leading to more efficient heat dissipation from electronic components, while also simplifying the manufacturing process.

Implementation Method 1

the pins of the pin row being spaced apart from one another along the longitudinal direction and being aligned with one another in the lateral direction such that a linear pin axis extending in the longitudinal direction traverses each pin of the pin row; the first and second internal sidewalls being disposed on opposite sides of the linear pin axis

Methodology Applied
Scientific EffectTurbulent flow: Turbulence

Implementation Method 2

a body (102) having a thermal transfer surface (108) configured to be placed in thermal contact with the heat-generating electronic component (50), the body defining a fluid conduit (115) for circulating a cooling fluid therein

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240074107A1Cooling block for cooling a heat-generating electronic component and method for manufacturing thereof
Publication Date: 2024.02.29 OVH
  • US20240074107A1 patent drawing
  • US20240074107A1 patent drawing
  • US20240074107A1 patent drawing

AI summary

A cooling block for cooling a heat-generating electronic component includes a body having a thermal transfer surface and defining a fluid conduit for circulating a cooling fluid therein. The fluid conduit has a passage extending from a first point to a second point along a longitudinal direction. The passage is defined in part by first and second internal sidewalls, each having a scalloped or undulating shape. A width of the passage is measured between the internal sidewalls in a lateral direction. The passage is defined in part by a pin row disposed between the internal sidewalls, the pin row including multiple pins. The pins of the pin row are spaced apart along the longitudinal direction and are aligned with each other in the lateral direction such that a linear pin axis extending in the longitudinal direction traverses each pin. A method for manufacturing a cooling block is also disclosed.