Cooling Block Channel Layout for Uniform Electronic Heat Dissipation
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Solution Overview
Problem
Existing cooling blocks for heat-generating electronic components are often inefficient and costly to manufacture, as they require complex designs and materials to effectively dissipate heat.
Innovation Solution
A cooling block design featuring a body with a thermal transfer surface and a fluid conduit having multiple channels of different dimensions, where the cooling fluid flows in parallel through first and second channels with varying heights and widths, optimized for efficient heat transfer and manufacturing simplicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex designs and materials are used to effectively dissipate heat, then cooling efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The fluid conduit is segmented into multiple parallel channels with different dimensional configurations (first channels with height h1 and width w1, second channels with height h2 and width w2). This segmentation allows the cooling block to handle heat dissipation more effectively while maintaining manufacturability through standardized channel designs that can be created using conventional milling processes.
Solution Approach 2:
Different regions of the cooling block have channels with different dimensional characteristics tailored to local heat dissipation needs. The first channels and second channels have different height and width configurations optimized for their specific thermal loads, allowing efficient heat transfer without requiring complex overall design.
2Reliability
If uniform cooling efficiency is achieved through optimized channel dimensions, then heat transfer performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent varies specific parameters (channel height and width) while maintaining the fundamental channel structure and milling manufacturing method. By changing only the dimensional parameters h1, w1, h2, w2 rather than the overall channel architecture, the design achieves uniform cooling efficiency without significantly increasing manufacturing complexity.
3Reliability
If multiple channel configurations are used to enhance heat absorption, then thermal management is improved, but manufacturing precision requirements increase
Solution Approach 1:
The milling process inherently creates the required channel dimensions through standard cutting depths and tool paths. The manufacturing method serves itself by using conventional milling techniques that naturally produce the specified channel heights and widths without requiring additional precision control mechanisms or complex manufacturing procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling block provides uniform cooling efficiency and is easier to manufacture by using a milling process to create channels with specific dimensions, enhancing heat absorption and convection, thus improving thermal management for electronic components.
Implementation Method 1
water (or other fluid) is made to flow through a conduit in the cooling block to absorb heat from the heat-generating electronic component
Implementation Method 2
As water flows out of the cooling block, so does the thermal energy collected thereby
Data Source
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AI summary
A cooling block includes a body having a thermal transfer surface configured to be in thermal contact with a heat-generating electronic component. The body defines a fluid conduit having a plurality of channels such that the cooling fluid flows in parallel along the channels. Each channel is defined between first and second internal sidewalls; and top and bottom walls. Each channel has either: a first dimensional configuration including first height and width values; or a second dimensional configuration including second height and width values. The first height value is greater than the second height value. The second width value is greater than the first width value. A thickness of a material of the body between the thermal transfer surface and a first channel is less than a thickness of the material of the body between the thermal transfer surface and a second channel.