Cooling Block Connector Design for Interference-Free Stacking

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Solution Overview

Problem

Existing cooling blocks for heat-generating electronic components are limited by size, shape, and configuration, which hinder efficient stacking and increase material usage, compromising space efficiency and thermal transfer surface area.

Innovation Solution

A modular cooling block design with connectors that allow for reduced thickness and interference-free piping connections, enabling multiple components to be stacked without increasing the overall footprint, while maintaining thermal transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If piping is directly connected to the cooling block, then fluid connection is achieved, but the piping interferes with thermal transfer surfaces

Engineering Contradiction:
Improvefluid connectionVSAvoidthermal transfer surface area
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The cooling block is divided into separate functional modules: a cooling block body containing thermal transfer surfaces, and a connector module that handles fluid connections. This segmentation allows the piping to connect to the connector rather than directly to the cooling block body, preventing interference with thermal transfer surfaces while maintaining fluid connection capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A connector is introduced as an intermediary component between the piping and the cooling block body. The connector has fluid pathways that receive cooling fluid from piping and direct it into the cooling block body, serving as a mediator that enables fluid connection without allowing piping to interfere with thermal transfer surfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If cooling block thickness is increased, then material strength is improved, but stacking efficiency is reduced

Engineering Contradiction:
Improvematerial strengthVSAvoidcooling block thickness
Core Design Contradiction:
StrengthVSLength of stationary object

Solution Approach 1:

The connector extends the fluid connection interface in a vertical dimension beyond the cooling block body thickness. This allows piping to connect to the top surface of the cooling block without requiring increased thickness, as the connector provides the necessary fluid pathways in the vertical direction while maintaining a compact overall profile for stacking.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If more material is used, then cooling block durability is improved, but material usage increases

Engineering Contradiction:
Improvecooling block durabilityVSAvoidmaterial usage
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The cooling block system is segmented into the cooling block body and a separate connector component. This allows each component to be optimized independently: the cooling block body uses material efficiently for thermal transfer functionality, while the connector uses material only where needed for fluid connection, reducing overall material usage while maintaining durability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connector serves multiple functions: it provides fluid connection interfaces for piping, directs cooling fluid into the cooling block body, and maintains structural integrity. This multi-functionality reduces the need for additional components and minimizes overall material usage while ensuring durability through a single integrated connector design.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design facilitates efficient cooling of multiple heat-generating components by minimizing material usage and maximizing thermal transfer surface area, allowing for cost-effective and space-efficient cooling solutions.

Implementation Method 1

water (or other fluid) is made to flow through a conduit in the cooling block to absorb heat from the heat-generating electronic component through the thermal transfer surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250227883A1Cooling block for cooling a heat-generating electronic component
Publication Date: 2025.07.10 OVH
  • US20250227883A1 patent drawing
  • US20250227883A1 patent drawing
  • US20250227883A1 patent drawing

AI summary

A connector for a cooling block having a connector body defining at least one connector passage. The connector is connectable to a top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of a conduit inlet and a conduit outlet of the cooling block. A cooling block comprising a cooling block body defining a fluid conduit therein for circulating a cooling fluid therethrough, the fluid conduit having a conduit inlet and a conduit outlet for receiving and discharging the cooling fluid respectively, and the connector connected to the top side of the cooling block body such that the at least one connector passage is in fluid communication with one or both of the conduit inlet and the conduit outlet of the cooling block.