Cooling Block Assembly With Heat Pipes for High Heat Density Chips
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Solution Overview
Problem
Existing cooling solutions for heat-generating electronic components, such as CPUs, are inefficient in managing the increased heat density of more powerful and smaller components, as they fail to effectively distribute heat away from these components.
Innovation Solution
A cooling block assembly comprising two cooling blocks, a heat spreading base, and heat distributing devices that utilize a phase change working substance to efficiently distribute heat through a serpentine fluid conduit and heat pipes, allowing for effective heat absorption and dissipation from high-power density components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a conventional cooling block is used for less power dense components, then cooling performance is adequate, but it fails to effectively manage heat from more power dense electronic components
Solution Approach 1:
The cooling block is divided into multiple cooling channels (first cooling channel, second cooling channel, third cooling channel, fourth cooling channel) that are distributed across different regions of the base. This segmentation allows each channel to target specific heat-generating areas, improving overall cooling efficiency for high-power density components
Solution Approach 2:
Different regions of the cooling block are designed with different channel configurations and densities. The first and second cooling channels are positioned to handle heat from specific areas, while the third and fourth channels address other regions. This local differentiation ensures optimal heat dissipation across the entire surface of high-power density components
2Power
If electronic components are made smaller and more powerful, then processing capability increases, but heat dissipation becomes more difficult
Solution Approach 1:
The cooling block extends the heat dissipation process into multiple spatial dimensions by creating a three-dimensional network of cooling channels within the base. The channels are arranged in different planes and depths, allowing heat to be conducted away from the component surface in multiple directions simultaneously, effectively managing heat from compact high-power components
Solution Approach 2:
The cooling block acts as an intermediary between the heat-generating electronic component and the cooling fluid. The multiple cooling channels provide intermediate heat transfer paths that efficiently conduct heat from the component surface through the base and into the flowing coolant, preventing heat accumulation in small high-power components
3Device complexity
If a single cooling channel is used, then the structure is simple, but heat distribution across the component surface is insufficient
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels (first, second, third, and fourth channels) that can be configured to cover different areas of the component surface. This segmentation allows comprehensive heat dissipation across the entire cooling surface while maintaining manageable complexity in each individual channel
Solution Approach 2:
Multiple cooling channels are merged into a single integrated cooling block structure. The channels work together in parallel to provide comprehensive cooling coverage across the entire base surface, achieving extensive area coverage while maintaining a unified and relatively simple overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling block assembly effectively spreads heat from high-power density components to a larger surface area, enhancing heat dissipation and maintaining component performance by utilizing a phase change mechanism and heat pipes to manage thermal energy.
Implementation Method 1
heat distributing devices that utilize a phase change working substance to efficiently distribute heat
Implementation Method 2
heat pipes to manage thermal energy
Implementation Method 3
heat distributing devices that utilize a phase change working substance to efficiently distribute heat through a serpentine fluid conduit and heat pipes
Implementation Method 4
water is made to flow through a conduit in the cooling block to absorb heat from the heat-generating electronic component
Data Source
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AI summary
A cooling block assembly for cooling a heat-generating electronic component includes: an upper block portion defining at least one internal fluid conduit and having a lower surface configured to face toward the heat-generating electronic component; a boss spaced from the lower surface and having a thermal transfer surface configured to be in thermal contact with the heat-generating electronic component, the thermal transfer surface being offset from the lower surface, a periphery of the thermal transfer surface being smaller than a periphery of the upper block portion, the periphery of the thermal transfer surface being contained within the periphery of the upper block portion in a projection thereof on a plane parallel to the thermal transfer surface; and heat distributing devices for distributing heat through a phase change of a working substance contained therein, each heat distributing device being disposed partially between the boss and the lower surface.