Cooling Block Passages With Scalloped Walls for Turbulent Heat Transfer

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Solution Overview

Problem

Existing cooling blocks for heat-generating electronic components are inefficient and costly to manufacture, and there is a need for improved heat dissipation solutions.

Innovation Solution

A cooling block design featuring a fluid conduit with passages that promote turbulent flow, utilizing a base and cover configuration with scalloped sidewalls and pin rows to enhance heat absorption, manufactured through milling techniques to create sinusoidal channels and pin arrangements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If conventional cooling block designs are used, then manufacturing is simpler, but heat absorption efficiency is insufficient

Engineering Contradiction:
Improveheat absorption efficiencyVSAvoidmanufacturing complexity
Core Design Contradiction:
Use of energy by moving objectVSEase of manufacture

Solution Approach 1:

The patent applies curvature by forming sinusoidal undulations on the sidewalls of the cooling block passages. These curved surfaces create turbulent flow patterns that enhance heat transfer efficiency between the cooling fluid and the heat-generating component, resolving the contradiction by improving thermal performance through geometric curvature rather than complex manufacturing processes

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent changes the flow regime parameter from laminar to turbulent flow by introducing sinusoidal undulations in the passage sidewalls. This parameter change increases the heat transfer coefficient and improves heat absorption efficiency while maintaining a relatively simple manufacturing process using conventional milling techniques

Inventive Principle:
Principle #35Parameter changes

2Productivity

If cooling block with turbulent flow passages is manufactured, then heat dissipation efficiency improves, but manufacturing cost and complexity increase

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidpassage structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the continuous passage sidewalls into periodic sinusoidal undulations. This segmentation creates multiple flow disruption zones along the passage length that collectively enhance turbulent flow and heat transfer, while each individual undulation remains simple to manufacture using standard milling operations

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements periodic sinusoidal undulations along the passage sidewalls. This periodic geometric feature creates recurring flow separation and reattachment zones that sustain turbulent flow and enhance heat transfer throughout the passage, achieving improved heat dissipation through a repeating pattern that simplifies manufacturing compared to arbitrary complex geometries

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design increases heat absorption efficiency by promoting turbulent flow, leading to more effective heat dissipation from electronic components.

Implementation Method 1

water (or other fluid) is made to flow through a conduit in the cooling block to absorb heat from the heat-generating electronic component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The sinusoidal undulations in the sidewalls of the passages promote turbulent flow, and thus improve heat transfer between the cooling fluid and the heat-generating component

Methodology Applied
Scientific EffectTurbulent flow: Turbulence

Data Source

PatentEP4333048B1Cooling block for cooling a heat-generating electronic component and method for manufacturing thereof
Publication Date: 2025.09.24 OVH
  • EP4333048B1 patent drawingFigure 1
  • EP4333048B1 patent drawingFigure 2
  • EP4333048B1 patent drawingFigure 3

AI summary

A cooling block for cooling a heat-generating electronic component includes a body having a thermal transfer surface and defining a fluid conduit for circulating a cooling fluid therein. The fluid conduit has a passage extending from a first point to a second point along a longitudinal direction. The passage is defined in part by first and second internal sidewalls, each having a scalloped or undulating shape. A width of the passage is measured between the internal sidewalls in a lateral direction. The passage is defined in part by a pin row disposed between the internal sidewalls, the pin row including multiple pins. The pins of the pin row are spaced apart along the longitudinal direction and are aligned with each other in the lateral direction such that a linear pin axis extending in the longitudinal direction traverses each pin. A method for manufacturing a cooling block is also disclosed.