Distinct Cooling Board for Electronic Unit Thermal Management

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Solution Overview

Problem

Existing cooling systems for electronic boards in equipment, such as aircraft, are complex due to the need for multiple cooling plates and fluid connections, leading to manufacturing, usage, and maintenance challenges.

Innovation Solution

A distinct cooling board with a fluid circulation channel is used to absorb heat from electronic boards, eliminating the need for direct integration with the boards and simplifying the cooling system by allowing attachment to the equipment's walls, thus reducing complexity and improving maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If each electronic board is provided with a cooling plate integrated directly to the board, then cooling effectiveness is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvecooling effectivenessVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is segmented into independent functional modules: heating elements are integrated only where needed on specific electronic boards, while cooling plates are positioned separately in dedicated cooling zones. This segmentation allows cooling infrastructure to be independent of individual board configurations, reducing overall system complexity while maintaining effective cooling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A fluid circulation system acts as an intermediary between the heating elements on electronic boards and the cooling plates. The fluid transfers thermal energy from heat-generating components to dedicated cooling zones, decoupling the heating and cooling functions and allowing independent optimization of each subsystem.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If cooling plates are fixed to each electronic board, then cooling performance is improved, but ease of manufacture and maintenance deteriorate

Engineering Contradiction:
Improvecooling performanceVSAvoidmanufacturing ease
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The cooling system is divided into independent modular components that can be manufactured separately and assembled later. Cooling plates are produced as standalone units without requiring integration with each specific electronic board, simplifying manufacturing processes and enabling standardized production.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cooling plates are designed as universal components that can serve multiple electronic boards simultaneously from dedicated cooling zones. A single cooling plate design can be used across different board configurations, reducing the number of unique parts and simplifying manufacturing and inventory management.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If multiple cooling plates are integrated with multiple electronic boards, then heat dissipation is improved, but ease of operation and maintenance deteriorate

Engineering Contradiction:
Improveheat dissipationVSAvoidease of maintenance
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The cooling function is extracted from individual electronic boards and consolidated into separate, dedicated cooling zones with centralized cooling plates. This extraction allows maintenance personnel to service the cooling system independently of the electronic boards, simplifying operations and reducing the need for specialized knowledge about each board's cooling requirements.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The fluid circulation system serves as an intermediary that connects multiple electronic boards to centralized cooling plates. This intermediary architecture allows a single cooling plate to service multiple boards, reducing the total number of cooling components that require maintenance while ensuring adequate heat dissipation for all connected boards.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies the cooling process, reduces manufacturing and maintenance costs, and allows for quick installation and replacement of cooling boards, enhancing the efficiency and ease of use in cooling electronic equipment.

Implementation Method 1

a board distinct from said electronic board, referred to as cooling board, capable, using a fluid, of at least partially absorbing the heat produced by said board or boards

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

The plate is mounted firmly on the printed circuit board of the electronic board so as to be in contact with the electronic components that dissipate the most heat

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9949403B2Method and device for cooling equipment provided with electronic boards, using at least one distinct fluid-cooled cooling board
Publication Date: 2018.04.17 AIRBUS OPERATIONS (SAS)
  • US9949403B2 patent drawing
  • US9949403B2 patent drawing
  • US9949403B2 patent drawing

AI summary

A device for cooling electronic boards grouped together in an electronic unit. The principle is that of providing at least one distinct cooling board that is introduced into the unit in place of one or more electronic board(s). The manufacture, use and maintenance of such a cooling device are thereby greatly optimized.