Cooling Chamber Boards With Thin Weld Channels for Faster Laser Welding
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Solution Overview
Problem
Conventional cooling devices face inefficiencies in laser welding due to uniform board thickness, leading to prolonged welding times and increased energy consumption, which hinders improved welding efficiency and reduced costs.
Innovation Solution
The cooling device features boards with thinner annular welding channels, allowing for easier laser penetration and reduced energy consumption, along with annular channels and supporting structures that facilitate efficient welding and enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If uniform board thickness is used in conventional cooling devices, then structural strength is maintained, but laser welding time is prolonged and energy consumption increases
Solution Approach 1:
The board structure transitions from uniform thickness to non-uniform thickness, with the welding portion having a first thickness and the non-welding portion having a second thickness greater than the first. This local differentiation optimizes laser welding efficiency at the welding location while maintaining overall structural integrity through the thicker non-welding portions.
Solution Approach 2:
The thickness parameter of the board is changed locally at the welding portion, creating a thickness gradient where the welding area has reduced thickness (first thickness) compared to the non-welding areas (second thickness). This parameter change enables faster laser penetration and reduced welding energy requirements.
2Loss of time
If uniform board thickness is used, then manufacturing simplicity is maintained, but welding time cannot be shortened
Solution Approach 1:
The board is designed with different thickness characteristics in different regions: the welding portion has a first thickness optimized for rapid laser welding, while the non-welding portion has a greater second thickness for structural support. This local quality differentiation reduces welding time without compromising overall device complexity.
3Strength
If thicker boards are used throughout, then structural strength is improved, but laser penetration and welding efficiency deteriorate
Solution Approach 1:
The board structure implements local quality optimization by having the welding portion with first thickness designed for easy laser penetration and welding, while the non-welding portion maintains greater second thickness for structural strength. This resolves the contradiction between strength and weldability.
Solution Approach 2:
The board is segmented into distinct functional zones: a welding portion with optimized thickness for laser processing and non-welding portions with greater thickness for structural support. This segmentation allows each zone to be optimized for its specific function without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design shortens welding times, reduces energy consumption, and improves welding efficiency while maintaining effective heat transfer and cooling performance.
Implementation Method 1
during laser welding of the lower board 91 and the upper board 92, the time for the materials of the welding portions of the lower board 91 and the upper board 92 to form a weld pool after absorbing the laser energy
Implementation Method 2
the time for the materials of the welding portions of the lower board 91 and the upper board 92 to form a weld pool
Implementation Method 3
The working fluid L proceeds with a gas-liquid phase change in the chamber 93 to transfer the heat of the heat source H outwards
Implementation Method 4
at least one of the two boards includes an annular welding channel on the outer face thereof... The smallest distance between the channel bottom face and the inner face of a respective one of the two boards which includes the annular welding channel is smaller than the smallest distance between the outer face and the inner face
Data Source
AI summary
A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.