Battery Cooling Box Structure With Sealed Upper Flow-Channel Plate
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Solution Overview
Problem
Conventional battery module cooling assemblies require complex sealing methods like full welding or gluing to ensure leak-proof connections, complicating the process and increasing the risk of leakage.
Innovation Solution
A cooling box design with a sealed accommodation space between the upper and lower flow-channel plates, where the upper flow-channel plate is sealingly connected to the chassis, eliminating the need for additional sealing between the lower flow-channel plate and the chassis, and incorporating a support structure and buffer heat insulation member for deformation and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If full welding or gluing is used to seal the connection between the lower flow-channel plate and the chassis, then the sealability is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the sealing requirement from the lower flow-channel plate connection and relocates it to the upper flow-channel plate connection. By removing the lower flow-channel plate from the sealed accommodation space and positioning it below the chassis, the sealing is performed only at the upper plate-chassis interface, eliminating the need for complex sealing at the lower plate connection.
Solution Approach 2:
Instead of sealing the lower flow-channel plate to the chassis as in conventional designs, the patent inverts the approach by sealing the upper flow-channel plate to the chassis and positioning the lower plate outside the sealed space. This inversion of the sealing location simplifies the overall sealing structure.
2Stability of the object's composition
If the lower flow-channel plate is directly connected to the chassis, then the structural stability is improved, but the sealability becomes problematic
Solution Approach 1:
The patent segments the cooling assembly into two distinct parts: the upper flow-channel plate that forms the sealed accommodation space with the chassis, and the lower flow-channel plate that is positioned below the chassis without requiring sealing. This segmentation allows each component to fulfill its function without compromising the other - the upper plate ensures sealability while the lower plate maintains structural stability.
3Stability of the object's composition
If the cooling assembly is rigidly fixed to prevent deformation, then the structural stability is improved, but the ability to accommodate thermal expansion and deformation decreases
Solution Approach 1:
The patent introduces a buffer heat insulation member made of elastically deformable soft material between the lower flow-channel plate and the chassis. This flexible element allows the cooling assembly to deform and accommodate thermal expansion while maintaining structural stability, as the elastic material can compress and expand with temperature changes without compromising the overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures airtightness and prevents cooling liquid leakage, reduces deformation of the cooling assembly, and maintains the cooling function while simplifying the sealing process and enhancing the structural stability of the battery pack.
Implementation Method 1
the buffer heat insulation member is made of an elastically deformable soft heat insulation material
Implementation Method 2
the buffer heat insulation member is made of an elastically deformable soft heat insulation material
Implementation Method 3
the heat dissipation of the battery module is realized by the heat exchanging with the cooling liquid
Data Source
AI summary
A cooling box and a battery pack are provided. The cooling box includes a chassis and a cooling assembly. The chassis is provided with a first side wall, a bottom wall and a lower accommodation cavity surrounded by the first side wall and the bottom wall. The cooling assembly is arranged in the lower accommodation cavity, and includes a lower flow-channel plate and an upper flow-channel plate. The upper flow-channel plate is sealingly connected to the chassis, and a sealed accommodation space is formed between the upper flow-channel plate and the chassis. The lower flow-channel plate is arranged in the accommodation space, and a flow-channel space is formed between the upper flow-channel plate and the lower flow-channel plate.