Electronic Device Cooling Bus Bar Connection

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Solution Overview

Problem

When housing a semiconductor unit inside a case, issues arise such as metal powder generation during bus bar connections leading to potential short-circuits, positional misalignment between the semiconductor unit and external output bus bar causing bending stress, and inefficient space usage due to varying coolant passage and bus bar positions.

Innovation Solution

The electronic device incorporates a cap nut, case, semiconductor unit, and connecting bolt with a U-shaped coolant passage and recessed portion for the cap nut, allowing the bus bars to be positioned based on the semiconductor unit, preventing metal powder spread and bending stress, and optimizing space usage by arranging the connecting portion within the coolant passage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bus bar and external output bus bar are connected inside the case with a nut and bolt, then electrical connection is achieved, but metal powder is generated that may move around and create short-circuits

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmetal powder generation and movement
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The connection operation is extracted from the case interior and moved to the exterior. The bus bar extends through the case wall to the outside, where the nut and bolt connection is performed externally, preventing metal powder generation inside the case while maintaining electrical connectivity.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of manufacture

If the external output bus bar is positioned based on the case, then positioning is simplified, but positional misalignment with the semiconductor unit occurs causing bending stress

Engineering Contradiction:
Improvepositioning simplicityVSAvoidbending stress on bus bar
Core Design Contradiction:
Ease of manufactureVSStress or pressure

Solution Approach 1:

The bus bar is preliminarily positioned relative to the semiconductor unit before final assembly. The bus bar extends through the case wall at a predetermined position that aligns with the semiconductor unit's bus bar, ensuring proper alignment is established in advance to prevent bending stress during connection.

Inventive Principle:
Principle #10Preliminary action

3Volume of moving object

If the case is made small to improve space efficiency, then compactness is achieved, but there is insufficient space for proper bus bar connection and coolant passage arrangement

Engineering Contradiction:
Improvecase sizeVSAvoidconnection space availability
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The connection operation is moved from the internal three-dimensional space to the external surface dimension. By extending the bus bar through the case wall and performing connections externally, the patent eliminates the need for internal connection space, allowing for more compact case design while maintaining adequate connection capabilities.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents metal powder from causing short-circuits, eliminates unnecessary stress on bus bars, and allows for a compact case design by ensuring efficient space utilization within the coolant passage.

Implementation Method 1

a passage through which coolant that cools the semiconductor unit flows inside the case

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

the connecting bolt passes through the first bus bar and the second bus bar and screws into the cap nut

Methodology Applied
Scientific EffectThreaded fastening: Screw

Data Source

PatentUS9877417B2Electronic device with cooling function
Publication Date: 2018.01.23 DENSO CORP
  • US9877417B2 patent drawing
  • US9877417B2 patent drawing
  • US9877417B2 patent drawing

AI summary

An electronic device with a cooling function includes a cap nut, a case, a semiconductor unit, a second bus bar for external output, and a connecting bolt. The case includes a side wall and a bottom surface. The bottom surface of the case has a coolant passage and a recessed portion to receive the cap nut. The coolant passage is open to above and is generally U-shaped. The recessed portion is positioned in a position surrounded by the coolant passage and the side wall of the case, and the cap nut is received in the recessed portion. The semiconductor unit includes a first bus bar that extends from the semiconductor unit. The semiconductor unit is fixed to the case in a posture and position that closes off the coolant passage from above. The second bus bar passes through the side wall of the case. Inside the case, the connecting bolt passes through the first bus bar and the second bus bar and screws into the cap nut, and the cap nut and a head portion of the connecting bolt bring the first bus bar and the second bus bar into close contact.