Semiconductor Cooling Case Inlet Layout for Uniform Refrigerant Flow
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Solution Overview
Problem
The installation of capacitors near semiconductor modules is limited by the placement of cooling device distribution pipes, leading to variations in cooling performance due to potential circulation issues of the refrigerant, which can result in decreased output and reliability of semiconductor devices.
Innovation Solution
A semiconductor device with a cooling device featuring a concave flow passage and an inflow passage with a diffusion surface, allowing the refrigerant to flow uniformly and preventing interference with capacitor installation, ensuring consistent cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If distribution pipes are connected to the inlet and outlet of the cooling device, then the refrigerant can circulate through the cooling device, but the installation position of the capacitor is limited and cooling performance may vary
Solution Approach 1:
The inlet of the cooling device is positioned on the lateral surface rather than on the top or bottom surfaces, utilizing the lateral dimension for fluid entry. This spatial reconfiguration allows the distribution pipes to be arranged without interfering with capacitor installation positions on the top surface, while the diffuser ensures uniform refrigerant distribution across all cooling channels for consistent cooling performance.
2Reliability
If the inlet is positioned at certain locations, then the structure is simplified, but the refrigerant may not circulate throughout the inside of the cooling device uniformly
Solution Approach 1:
A diffuser is installed at the inlet to pre-distribute the refrigerant into multiple directions before it enters the main flow passages. This preliminary action ensures that the refrigerant is evenly distributed across all cooling channels from the start, preventing circulation dead zones and ensuring uniform cooling performance throughout the semiconductor module without requiring complex multi-inlet configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform cooling performance across the semiconductor module, allowing for the installation of capacitors without reducing reliability and improving the overall performance of the semiconductor device.
Implementation Method 1
the inflow passage having a diffusion surface that faces the opening of the inlet
Implementation Method 2
The refrigerant flows into the cooling device from the inlet by the pump, then circulates through the cooling device, and flows out from the outlet
Data Source
AI summary
A cooling case has outer lateral surfaces located on long sides and outer lateral surfaces located on short sides thereof in plan view. The cooling case has a flow passage having a concave shape therein. The flow passage includes a main passage, and an inflow passage recessed from a bottom surface of the main passage toward a bottom side of the cooling case. The cooling case further has an inlet that is provided at one of the outer lateral surface to be directly connected to the inflow passage. The inlet introduces a cooling medium that flows through the inlet in a longitudinal direction of the cooling case toward the flow passage and the inflow passage has a diffusion surface that faces an opening of the inlet.