Electronic Component Cooling Channel with High Conductivity Radiator
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Solution Overview
Problem
Existing cooling technologies for electronic components, such as those described in patent literature 1 and 2, are inadequate in effectively radiating internal heat due to limitations in thermal conductivity and heat transfer efficiency, particularly with increasing thermal density from higher integration and denser packaging.
Innovation Solution
An electronic component design featuring a cooling channel with a radiator made of high thermal conductivity material, such as copper or aluminum, that projects into the channel to enhance heat transfer from the component's heat sources to a flowing cooling medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling channels are used in electronic components, then the structure is simple, but heat radiation efficiency is insufficient due to low thermal conductivity
Solution Approach 1:
The patent changes the material parameter of the cooling channel from conventional materials to high thermal conductivity materials such as copper or aluminum, thereby improving heat radiation efficiency while maintaining structural simplicity
Solution Approach 2:
The patent employs composite material structure by combining high thermal conductivity materials (copper/aluminum) with the base semiconductor substrate, creating a hybrid cooling channel that achieves superior thermal performance
2Temperature
If high thermal conductivity material is used for cooling channel, then heat transfer efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies high thermal conductivity materials specifically to the cooling channel portions that require efficient heat transfer, rather than using these expensive materials throughout the entire electronic component structure, thereby optimizing the balance between performance and cost
3Productivity
If denser packaging is implemented to follow Moore's Law, then integration density is improved, but heat density increases making cooling more difficult
Solution Approach 1:
The patent addresses the heat density issue arising from denser packaging by changing the thermal conductivity parameter of the cooling channel materials, enabling effective heat dissipation even as integration density increases
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively radiates heat generated within the electronic component, providing a significant cooling effect by efficiently transferring heat from the component's internal sources to the cooling medium.
Implementation Method 1
a radiator formed in a surface of the cooling channel using a material of which thermal conductivity is higher than a thermal conductivity of the base substance
Implementation Method 2
flows a cooling medium in a second direction from a first direction and a radiator formed in a surface of the cooling channel
Data Source
AI summary
An electronic component includes a base substance, a cooling channel formed in the base substance and flows a cooling medium in a second direction from a first direction, a radiator formed in a surface of the cooling channel using a material of which thermal conductivity is higher than a thermal conductivity of the base substance or formed so that the radiator may project to the cooling channel, and that contacts the cooling medium.