Laser-Formed Cooling Channels That Bypass Substrate Inclusions
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Solution Overview
Problem
Existing methods for producing temperature-controlling hollow structures in substrates, such as those used in EUV projection exposure apparatuses, often result in non-uniform cross sections due to gas bubbles and inclusions, leading to incomplete processing and irregular channel formation.
Innovation Solution
A method that involves measuring the location of inclusions in the substrate and adjusting the direction of the processing light beam to avoid intersections with these inclusions, using a beam-profile changing device to modify the beam profile, and employing a lance for mechanical removal of residues to ensure uniformity and smoothness of the hollow structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a processing light beam is focused onto processing locations to produce cooling channels, then the substrate material is modified or removed to form hollow structures, but the walls of the cooling channels become irregular and non-uniform due to gas bubbles and inclusions
Solution Approach 1:
The patent applies preliminary action by measuring and mapping the locations of gas bubbles and inclusions in the substrate before the actual processing begins. This pre-knowledge allows the system to plan beam paths that avoid these harmful factors, preventing them from interfering with the processing and ensuring uniform channel walls.
Solution Approach 2:
The patent implements dynamics by making the beam axis direction changeable and adjustable during processing. When an inclusion is detected on the beam axis, the system dynamically tilts the beam axis to bypass the inclusion while still reaching the intended processing location, thereby maintaining manufacturing precision despite the presence of harmful factors.
2Productivity
If the beam axis direction is changed to avoid inclusions, then the processing can continue without interruption, but the beam axis deviates from the standard direction requiring additional control complexity
Solution Approach 1:
The patent applies feedback by using measurement data about inclusion locations to control the beam axis direction. The system continuously monitors which inclusions are on the beam axis and adjusts the beam direction accordingly, ensuring continuous processing while managing the complexity through intelligent control based on real-time feedback.
Solution Approach 2:
The system performs self-service by automatically detecting when an inclusion is on the beam axis and autonomously adjusting the beam direction to bypass it. This self-adjusting capability maintains productivity without requiring external intervention, while the control complexity is managed through automated decision-making based on measurement data.
3Temperature
If cooling channels are produced to dissipate heat from EUV mirrors, then the mirror substrate can be cooled effectively, but the channels require smooth walls for uniform fluid flow which is difficult to achieve due to substrate inhomogeneities
Solution Approach 1:
The patent applies preliminary action by measuring and identifying the locations of gas bubbles and inclusions before processing the cooling channels. This advance knowledge allows the system to plan beam paths that avoid these inhomogeneities, ensuring that the channel walls are formed smoothly and uniformly, which is essential for effective cooling through uniform fluid flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of temperature-controlling hollow structures with more uniform cross sections and smoother inner surfaces, reducing the risk of process interruptions and enhancing the functionality of the substrates by ensuring effective cooling or heating fluid flow.
Implementation Method 1
working the temperature-controlling hollow structure into the substrate by focusing a processing light beam with a beam axis aligned along a standard direction successively onto processing locations at which the temperature-controlling hollow structure is to be produced, as a result of which the substrate is modified or removed at the processing locations
Data Source
AI summary
In the case of a method for producing a temperature-controlling hollow structure in a substrate, first of all a substrate consisting of a substrate material is provided. The substrate is surveyed in order to ascertain where inclusions are in the substrate. Then, a temperature-controlling hollow structure is worked into the substrate by focusing a processing light beam with a beam axis aligned along a standard direction successively onto processing locations at which the temperature-controlling hollow structure is to be produced. As a result, the substrate material is modified or removed at the processing locations. If an inclusion is on the beam axis aligned along the standard direction, the direction of the beam axis relative to the mirror substrate is changed such that the beam axis does not intersect the inclusion.