Cooling Chimney Structure for Bubble Field Breakup in Two-Phase Chips
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Solution Overview
Problem
Current cooling technologies for high-performance computing environments, such as data centers, are inadequate for handling intense heat loads generated by modern processors, leading to inefficiencies, high costs, and safety risks, and traditional methods introduce communication latencies and corrosion issues.
Innovation Solution
A two-phase cooling system utilizing Enhanced Nucleation Evaporators (ENE), Heat Rejection Units (HRU), and Refrigerant Distribution Units (RDU) for direct-on-chip cooling, employing non-aqueous dielectric coolants to manage heat transfer and phase change, with a chimney mechanism to break up bubble fields and enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional water-based cooling techniques are used, then cooling effectiveness is improved, but risk of short-circuiting and corrosion increases
Solution Approach 1:
The patent introduces a dielectric liquid as an intermediary cooling medium that transfers heat from electronic components without causing short-circuiting or corrosion. The dielectric liquid acts as a mediator between the heat source (electronic components) and the heat sink, providing effective cooling while maintaining electrical isolation and chemical compatibility with system components.
2Temperature
If air conditioning units are installed inside data centers, then cooling capacity is improved, but cost increases significantly
Solution Approach 1:
The patent extracts the cooling function from traditional air conditioning systems and implements it directly at the component level through liquid cooling channels integrated with electronic components. This approach removes the need for expensive centralized air conditioning infrastructure by providing distributed, efficient cooling directly where heat is generated.
Solution Approach 2:
The patent employs liquid coolant flow through integrated cooling channels to transfer heat directly from electronic components. This hydraulic cooling approach replaces mechanical air conditioning systems with a more efficient fluid-based thermal management system that operates at the component level, significantly reducing infrastructure costs.
3Use of energy by stationary object
If data centers are located in cool climates or adjacent to bodies of water, then cooling cost is reduced, but communication latency increases
Solution Approach 1:
The patent enables data centers to generate their own cooling capacity through integrated liquid cooling systems that use dielectric liquids and phase-change materials. This self-service cooling approach eliminates dependence on external environmental conditions, allowing data centers to be located anywhere while maintaining efficient cooling performance without the communication latency issues associated with remote cooling locations.
4Device complexity
If older cooling technologies are used, then device complexity is reduced, but cooling effectiveness for high-performance components is insufficient
Solution Approach 1:
The patent applies local quality by providing customized cooling solutions for different regions of electronic components. The cooling channels and dielectric liquid distribution are tailored to match the specific heat generation patterns of high-performance components, delivering concentrated cooling capacity exactly where needed rather than using uniform, oversimplified cooling approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides effective, safe, and cost-efficient cooling for electronic components, eliminating hot spots and reducing the need for specialized air-conditioning or cooling water, while maintaining system performance and safety.
Implementation Method 1
A heat transfer wall in thermal contact with the heat-generating component immerses a portion of its inner surface in the dielectric liquid to facilitate heat transfer
Implementation Method 2
Heating of the dielectric liquid by the heat transfer wall sets up natural convection within the liquid
Implementation Method 3
A portion of the liquid at a boiling surface of the liquid pool is heated to a boiling point by the heat transfer wall
Implementation Method 4
employing non-aqueous dielectric coolants to manage heat transfer and phase change
Data Source
AI summary
A cooling device configured to induce internal counterflow, comprising: a chamber for containing a liquid coolant; a liquid coolant inlet in the chamber; a vapor outlet in a vapor collection region of the chamber for evacuating vaporized liquid coolant from the chamber; a heat conducting element in a boiling region of the chamber; a coolant pool region interposed between the vapor collection region and the boiling region; and at least one conduit extending from the boiling region toward the vapor collection region, the at least one conduit being configured to direct vapor in a first direction toward the vapor collection region thereby facilitating liquid coolant movement toward the boiling region in a second direction counter to the first direction.