Liquid Cooling Conduit Waveguide for Multi-Chip Data Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current data transmission methods in multi-chip package structures face challenges with signal attenuation and frequency dispersion when transmitting high-frequency signals, and existing cooling systems occupy valuable space within server systems.
Innovation Solution
Integration of a liquid cooling conduit that serves as a waveguide for high-speed data transmission between IC chips, utilizing monopole feeds and mesh signal reflectors to maintain signal propagation while circulating coolant, thereby combining heat dissipation and data transmission functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If planar transmission lines are used for data transmission, then data can be transmitted between package components, but signal attenuation and frequency dispersion occur at high frequencies
Solution Approach 1:
The patent combines the cooling system and data transmission system into a single integrated structure. The liquid cooling conduit serves dual purposes: removing heat from IC chips and transmitting electromagnetic signals for high-speed data communication. This merging eliminates the need for separate transmission lines, reducing signal attenuation and frequency dispersion while maintaining effective cooling.
2Temperature
If separate cooling systems are implemented, then heat dissipation is effective, but valuable space within server systems is occupied
Solution Approach 1:
The liquid cooling conduit is designed to perform multiple functions simultaneously. It serves as both a thermal management component for heat dissipation and as a waveguide for electromagnetic signal transmission. This multi-functionality reduces the overall space required in the server system by eliminating redundant components.
3Productivity
If conventional transmission lines are used, then data transmission is possible, but space efficiency is reduced due to separate cooling infrastructure
Solution Approach 1:
The invention merges the cooling infrastructure with the data transmission infrastructure into a single integrated conduit system. The liquid cooling pipe serves as the transmission medium for electromagnetic signals, eliminating the need for separate planar transmission lines and reducing overall space requirements while maintaining high bandwidth capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling conduit effectively transmits high-speed data and dissipates heat, minimizing space consumption and improving data transmission speeds up to hundreds of Gbps, suitable for millimeter-wave to terahertz frequencies.
Implementation Method 1
a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip
Implementation Method 2
Air and liquid cooling techniques have been applied to cool servers that have high-power devices such as CPUs and graphics processing units (GPUs)
Implementation Method 3
The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit
Implementation Method 4
Integration of a liquid cooling conduit that serves as a waveguide for high-speed data transmission between IC chips
Data Source
AI summary
A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.