Cooling device for air conditioner circuit board
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current air conditioners face challenges in coordinating frequency and heat exchange, leading to reduced user comfort due to high chip module board temperatures and decreased refrigerating capacity at high ambient temperatures.
Innovation Solution
A cooling device for air conditioner circuit boards, comprising a compressor, outdoor heat exchanger, gas-liquid separator, and indoor heat exchanger connected in sequence, with a cooling pipeline and throttling devices to manage refrigerant flow and pressure, ensuring effective heat exchange and refrigerating capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the air conditioner frequency is reduced to protect the semiconductor chip from overheating, then the chip module board temperature is controlled, but the refrigerating capacity decreases
Solution Approach 1:
The patent separates the cooling function into two independent systems: (1) the main refrigeration cycle for providing cooling capacity, and (2) a dedicated cooling circuit for the circuit board using a separate heat exchanger. This segmentation allows the refrigeration system to maintain high frequency and capacity while the circuit board cooling system independently manages chip temperature through its own refrigerant flow path.
Solution Approach 2:
The patent introduces a dedicated circuit board heat exchanger as an intermediary component between the refrigeration system and the circuit board. This heat exchanger acts as a thermal mediator that directly absorbs heat from the circuit board through thermal conduction, while the refrigerant in this separate circuit handles only the board cooling load, allowing the main refrigeration cycle to operate independently at optimal frequency.
2Productivity
If the air conditioner operates at high frequency to maintain refrigerating capacity, then the cooling performance is improved, but the chip module board temperature increases
Solution Approach 1:
The patent divides the thermal management into separate functional segments: the main refrigeration cycle handles space cooling requirements, while an independent circuit board cooling circuit with its own heat exchanger and refrigerant flow path handles electronic component thermal management. This allows high-frequency operation for refrigeration without thermally coupling the circuit board to the high-load refrigeration cycle.
Solution Approach 2:
A dedicated circuit board heat exchanger serves as a thermal intermediary that provides direct heat dissipation for the circuit board through thermal conduction. The refrigerant in this intermediary circuit absorbs heat from the board at a controlled rate independent of the main refrigeration frequency, enabling the system to maintain high refrigerating capacity while keeping chip temperatures within safe limits.
3Temperature
If a separate cooling system for the circuit board is added, then the chip temperature is controlled, but the device complexity increases
Solution Approach 1:
The patent merges the circuit board cooling function with the existing refrigeration system by integrating a circuit board heat exchanger into the refrigeration circuit architecture. The cooling device utilizes the refrigerant circulation infrastructure already present in the air conditioner, combining the refrigeration and electronics cooling functions into a unified system that shares common components such as the compressor, expansion valve, and refrigerant loops, thereby reducing overall system complexity compared to completely separate cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution coordinates air conditioner frequency and heat exchange, enhancing user comfort by maintaining refrigerating capacity and improving compressor efficiency, while effectively dissipating heat from the circuit board.
Implementation Method 1
a cooling equipment for cooling the air conditioner circuit board is provided on the cooling pipeline
Implementation Method 2
a gas outlet end of the gas-liquid separator is communicatively coupled with a gas suction port of the compressor by means of a cooling pipeline
Implementation Method 3
a gas-liquid separator...which are connected in sequence
Implementation Method 4
a compressor...which are connected in sequence
Implementation Method 5
outdoor heat exchanger, a gas-liquid separator, and an indoor heat exchanger
Implementation Method 6
outdoor heat exchanger, a gas-liquid separator, and an indoor heat exchanger
Data Source
AI summary
A cooling device for air conditioner circuit board includes a compressor, an outdoor heat exchanger, a gas-liquid separator, and an indoor heat exchanger which are connected in sequence. A gas outlet end of the gas-liquid separator is communicatively coupled with a gas suction port of the compressor through a cooling pipeline, and a cooling equipment for cooling the air conditioner circuit board is provided on the cooling pipeline.