Cooling Device Heat Pipe Segmented Base Member

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing cooling devices for portable computers face manufacturing complexity due to multiple bends in the base member, inefficient heat conductivity, and increased thickness, which hinders effective heat dissipation and thinning of devices.

Innovation Solution

A cooling device comprising a heat diffusion plate, a heat receiving portion, a heat sink, and a heat pipe, where the heat receiving portion is thermally connected to the object to be cooled, and the heat pipe connects both ends to the heat sink, with the fan unit positioned to minimize thickness and enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the base member is bent multiple times to form a groove section for the heat pipe, then the heat pipe can be thermally connected to the fin, but the manufacturing process becomes complicated

Engineering Contradiction:

Improvethermal connection between heat pipe and finVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The base member is divided into a first base member and a second base member that are separately formed and then joined together. This segmentation eliminates the need for complex multi-time bending operations while still providing the necessary groove section for heat pipe installation and thermal connection to the fin.

Inventive Principle:

Principle #1Segmentation

2Reliability

If the heat pipe is thermally connected to the circuit parts by its mid portion, then heat can be propagated to the fin, but heat propagated towards the opposite end is not released and increases temperature inside the housing

Engineering Contradiction:

Improveheat propagation to finVSAvoidtemperature inside housing

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The harmful heat that would otherwise be propagated to the opposite end of the heat pipe is extracted and redirected. The second base member is positioned to block this heat propagation path and guide the heat toward the fin, ensuring all heat is effectively dissipated and preventing temperature increase inside the housing.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If the fan unit is mounted on the upper side of the heat pipe, then cooling can be provided, but the thickness of the cooling device is increased

Engineering Contradiction:

Improvecooling functionVSAvoidthickness of cooling device

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The fan unit is repositioned from a vertical arrangement (above the heat pipe) to a horizontal arrangement (adjacent to the heat pipe in the planar direction). This dimensional change allows the cooling function to be maintained while significantly reducing the thickness of the cooling device, enabling thinner portable computer designs.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Ease of operation

If the inner surface of the base member and exposed surface of the heat pipe are flushed, then turbulent flow is prevented and air flow is smoothed, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveair flow smoothnessVSAvoidmanufacturing process complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The base member is segmented into two separate components that are joined together. This segmentation naturally creates the flushed arrangement between the inner surface of the base member and the exposed surface of the heat pipe, achieving smooth air flow without requiring complex multi-step bending operations.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves heat conductivity and reduces device thickness by ensuring all heat is dissipated efficiently, preventing heat stagnation within the housing and promoting effective cooling of electronic components.

Implementation Method 1

a heat pipe having a first end portion connected to the heat receiving portion and a second end portion connected to the heat sink

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

the heat pipe connects both ends to the heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a heat sink provided on the heat diffusion plate, and releasing the heat of the heat receiving portion to outside

Methodology Applied

Scientific EffectHeat sink: Heat Sink

Implementation Method 4

with the fan unit positioned to minimize thickness and enhance heat dissipation

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS7742295B2Cooling device and electronic device

Publication Date: 2010.06.22 DYNABOOK INC

AI summary

According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.