Cooling Distribution Unit Direct Mechanical Connections

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Solution Overview

Problem

Conventional thermal management solutions for high-performance computing systems rely on external fluid conduits, which occupy valuable space, limit the size and capacity of cooling distribution units (CDUs), and have limited heat dissipation capabilities.

Innovation Solution

The implementation of direct mechanical connections, such as blind mate connectors, allows CDUs to directly interface with in-rack fluid distribution systems without external fluid conduits, maximizing the dimensions of the CDU and enhancing its thermal management capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If external fluid conduits are used to connect CDUs, then fluid communication is established, but valuable space is occupied and CDU dimensions are limited

Engineering Contradiction:
ImproveCDU housing volumeVSAvoidexternal fluid conduits
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent merges the CDU housing with the fluid distribution system by integrating direct mechanical connections (blind mate connectors) directly into the housing structure. This eliminates the need for separate external fluid conduits, thereby maximizing the usable volume of the CDU housing while maintaining fluid communication capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the external fluid conduits from the system by implementing direct mechanical connections within the housing. This removal of unnecessary components frees up valuable space and simplifies the overall device structure while preserving the essential fluid distribution function.

Inventive Principle:
Principle #2Taking out (Extraction)

2Power

If external fluid conduits are used, then fluid distribution is achieved, but heat dissipation capability is limited

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidexternal fluid conduits
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent combines the thermal management components directly within the housing that now contains maximized volume. This integration allows for more substantial heat dissipation components (such as heat sinks, thermal pads, or cooling channels) to be incorporated directly into the CDU structure, thereby enhancing heat dissipation capability while eliminating external conduits.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of repair

If external fluid conduits are used, then fluid communication is established, but serviceability is reduced

Engineering Contradiction:
ImproveserviceabilityVSAvoidexternal fluid conduits
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The patent extracts and removes the external fluid conduits that complicate maintenance and repair operations. By eliminating these external components and replacing them with integrated direct mechanical connections, the system becomes easier to service as there are fewer external parts that can leak, disconnect, or require maintenance.

Inventive Principle:
Principle #2Taking out (Extraction)

4Power

If CDU housing volume is maximized, then thermal management component capacity is increased, but external space requirements increase

Engineering Contradiction:
Improvethermal management capacityVSAvoidhousing volume
Core Design Contradiction:
PowerVSVolume of stationary object

Solution Approach 1:

The patent merges the fluid distribution function directly into the housing structure through integrated blind mate connectors. This integration allows the housing volume to be optimized for thermal management component capacity without requiring additional external space for separate conduit systems, as the fluid distribution capability is built into the housing itself.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution increases the size and capacity of thermal management components within the CDU, enables more efficient heat dissipation, and improves serviceability by eliminating the need for external conduits, thereby enhancing the operational capabilities of high-performance computing systems.

Implementation Method 1

The one or more thermal management components may be configured dissipate heat of a fluid received by the CDU via the fluid inlet

Methodology Applied
Scientific EffectHeat dissipation: Heat Exchanger

Data Source

PatentUS20250120052A1Cooling distribution units and in-rack thermal management systems
Publication Date: 2025.04.10 NVIDIA CORP
  • US20250120052A1 patent drawing
  • US20250120052A1 patent drawing
  • US20250120052A1 patent drawing

AI summary

Devices, apparatuses, and systems for thermal management in networking and computing systems are provided. An example in-rack thermal management system includes a cooling distribution unit (CDU) that includes a housing that defines a fluid inlet and a fluid outlet, thermal management components supported by the housing, and direct mechanical connections coupled with the fluid inlet and the fluid outlet. The in-rack thermal management system includes a fluid distribution system that includes a primary fluid channel directly coupled with the direct mechanical connection of the fluid inlet, and a secondary fluid channel directly coupled with the direct mechanical connection of the fluid outlet. In operation, the thermal management components dissipate heat of a fluid received by the CDU via the fluid inlet. The direct mechanical connections directly interface with the fluid distribution system to provide fluid communication between the CDU and the fluid distribution system to maximize dimensions of the housing.