Cooling Element Microchannel Recesses Using Spark Erosion
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Solution Overview
Problem
Existing cooling elements for electrical and electronic components, such as laser diodes, face limitations in achieving optimal heat dissipation due to the minimum distance constraint between web-like elements, which restricts the fin structure's cooling efficiency.
Innovation Solution
A method involving spark erosion to create finely structured recesses in a single metal layer, allowing for narrower cooling fluid channels and improved heat transfer without the need for stacking multiple thin layers, enabling smaller distances between web-like elements and enhanced cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If multiple thin metal layers are stacked to achieve small distances between rib-like elements, then the distance between adjacent elements can be reduced, but manufacturing precision deteriorates due to offset between layers
Solution Approach 1:
The invention divides the recess formation process into two independent stages: first forming a base recess by etching, then forming a fine-structured subsection by spark erosion. This segmentation allows each process to optimize for its specific requirement - the etching process creates the overall structure while the spark erosion process creates the precise fine features without being constrained by layer stacking offsets.
Solution Approach 2:
The invention replaces the mechanical stacking of multiple thin metal layers with a single-layer approach where complex 3D recess structures are created through spark erosion. This substitution eliminates the mechanical alignment problems inherent in stacking multiple layers while achieving the same goal of small distances between rib-like elements.
2Ease of manufacture
If conventional etching is used to form recesses, then manufacturing is simpler, but the distance between adjacent rib-like elements cannot be reduced below 0.3 mm
Solution Approach 1:
The invention merges two manufacturing processes - conventional etching and spark erosion - into a complementary workflow. The etching process handles the bulk material removal and overall recess shape, while the spark erosion process handles the fine-structured subsections. This combination allows the benefits of both simple manufacturing (etching) and high precision (spark erosion) to work together.
Solution Approach 2:
The invention changes the processing parameters by introducing spark erosion with controlled electrical discharge to create fine-structured recess subsections. This parameter change enables distances between rib-like elements to be reduced below the 0.3 mm limit of conventional etching alone, while the overall process remains manufacturable through the complementary etching step.
3Productivity
If multiple thin metal layers are stacked to increase fin structure density, then cooling efficiency improves, but device complexity increases
Solution Approach 1:
The invention extracts the fine-structured recess subsections from the conventional multi-layer stacking approach and creates them directly in a single metal layer using spark erosion. This extraction eliminates the need for multiple thin layers while maintaining the high fin structure density required for cooling efficiency.
Solution Approach 2:
The invention transitions from a 2D planar approach (stacking thin layers in the vertical dimension) to a 3D volumetric approach (creating complex recess shapes within a single layer). This dimensional change allows fin structures to be formed with high density without increasing the number of layers, thereby improving cooling efficiency while reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of cooling elements with significantly improved cooling efficiency by allowing for much smaller and narrower fin structures, effectively increasing the contact area with the cooling fluid and enhancing heat dissipation.
Implementation Method 1
at least a first part of the at least one recess in the at least one first metal layer is realized by erosion, in particular spark erosion
Data Source
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AI summary
The invention relates to a method for producing a cooling element (1) for an electric or electronic component, in particular a semiconductor element, the completed cooling element (1) having a cooling fluid channel system through which a cooling fluid can be conducted during operation. The method has the steps of: - providing at least one first metal layer (11), - providing at least one recess (21, 22) in the at least one first metal layer (11), and - forming at least one sub-section of the cooling channel system using the at least one recess (21, 22), wherein at least one first part (21) of the at least one recess (21, 22) in the at least first metal layer (11) is produced by an erosion process, in particular a spark erosion process.