Cooling Device Fault Detection via Semiconductor Temperature Differences
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Solution Overview
Problem
Existing cooling device malfunction detection systems fail to specify the fault location, particularly when clogging occurs due to foreign matter in the coolant passage, making it difficult to distinguish from failures in other components.
Innovation Solution
A malfunction detecting device and method that utilize a control unit to detect temperature differences between semiconductor elements to identify clogging in a predetermined site within the coolant passage, where the coolant flow is likely to be obstructed, by using temperature detecting units and estimating temperatures based on current and operating frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature detection is performed using existing methods, then malfunction detection is achieved, but fault location specification is not possible
Solution Approach 1:
The coolant passage is divided into multiple sections, each serving a specific semiconductor element. Temperature detection is performed at multiple locations corresponding to different segments of the cooling system. This segmentation enables identification of which specific segment is experiencing clogging, thereby specifying the fault location without requiring complex additional sensors throughout the entire system.
Solution Approach 2:
Temperature detection is performed locally at specific points where semiconductor elements are cooled, rather than using a single global temperature sensor. By comparing temperature differences at different local positions (first temperature at first semiconductor element, second temperature at second semiconductor element), the system can identify local clogging issues and specify their locations.
2Measurement precision
If general malfunction detection is performed, then system reliability is monitored, but diagnostic accuracy for specific faults is insufficient
Solution Approach 1:
The system continuously monitors temperature differences between semiconductor elements and provides feedback to the control unit. When the temperature difference exceeds a predetermined threshold, the system identifies clogging and can trigger appropriate responses. This feedback mechanism maintains system reliability by enabling early detection and specification of faults, allowing for timely intervention before complete cooling failure occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise identification of fault locations in cooling devices by detecting temperature differences between semiconductor elements, effectively distinguishing clogging from other component failures, thereby improving diagnostic accuracy.
Implementation Method 1
a first temperature detecting unit for detecting a first temperature of the first semiconductor element
Implementation Method 2
a first heat dissipating portion for dissipating heat of the first semiconductor element, a second heat dissipating portion for dissipating heat of the second semiconductor element
Implementation Method 3
a coolant passage for allowing coolant to flow in the first heat dissipating portion and the second heat dissipating portion in parallel
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An ECU executes a program including the steps of: obtaining (S100) a first temperature Ta of a first semiconductor element; obtaining (S102) a second temperature Tb of a third semiconductor element; determining (S110) that it is in a normal state in which clogging has not occurred, when a rotating speed Nm2 of a second MG is more than a threshold value Nm2(0) (YES in S104) and the magnitude of a difference between the first temperature Ta and the second temperature Tb is less than a threshold value ΔT (YES in S106); and determining (S112) that the clogging of a foreign matter has occurred in a predetermined site when the magnitude of the difference between the first temperature Ta and the second temperature Tb is equal to or more than the threshold value ΔT (NO in S106).