Semiconductor Module Cooling Fin Fixing Mechanism
Solution Overview
Problem
Existing semiconductor devices require space for threaded holes in the heat radiating base, limiting their size reduction potential.
Innovation Solution
Incorporating a fixing cooling fin with a threaded hole and a snap-fitting mechanism, along with O-rings and counterbores, to securely attach the cooling jacket to the semiconductor module without increasing device size, while allowing for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If threaded holes are provided in the heat radiating base to fix the cooling jacket, then the cooling jacket can be securely attached, but the device size increases due to the required securing spaces
Solution Approach 1:
The invention relocates the threaded hole from the heat radiating base (horizontal plane) to the cooling fin (vertical dimension). The cooling fin extends outward from the heat radiating base, providing a new dimensional space for the threaded hole that does not increase the device's footprint. This allows the cooling jacket to be fixed securely while maintaining a compact device size.
Solution Approach 2:
The invention separates the fixing function from the heat radiating base by using a dedicated cooling fin structure. The cooling fin, which is already part of the heat dissipation system, is segmented to include a threaded hole for fixing purposes. This segmentation allows the fixing mechanism to be integrated into an existing component without requiring additional space in the heat radiating base.
2Temperature
If the cooling jacket is tightly fitted to ensure cooling efficiency, then cooling performance improves, but the O-ring may contact the cooling medium causing reliability issues
Solution Approach 1:
The invention introduces a protrusion on the cooling jacket that acts as an intermediary barrier between the O-ring and the cooling medium. This protrusion creates a sealing interface that prevents the cooling medium from reaching the O-ring, thereby protecting the O-ring from degradation while maintaining effective sealing for cooling efficiency.
Solution Approach 2:
The design anticipates the potential harm of cooling medium contact with the O-ring by incorporating a protective protrusion structure in advance. This protrusion serves as a pre-established barrier that prevents the cooling medium from reaching the O-ring, cushioning against potential reliability issues before they can occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a reduction in semiconductor device size while maintaining effective cooling and improving reliability and durability by preventing O-ring contact with the cooling medium.
Implementation Method 1
a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw
Implementation Method 2
a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed
Data Source
AI summary
A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.