Cooling Fin Profile Design for Power Electronics Thermal Management
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Solution Overview
Problem
Existing cooling fin geometries in coolers that allow fluid flow are inadequate for efficiently cooling power electronics due to suboptimal thermal performance and pressure loss ratios.
Innovation Solution
A cooling fin with a periodically repeating profile, such as corrugated, meander-shaped, or cross-shaped designs, that enhances heat transfer and surface area while minimizing pressure loss, produced through punching, roll forming, or extrusion processes, to optimize thermal performance for high-power electronic applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing fin geometries are used in coolers with fluid flow, then the structure is simple to manufacture, but the thermal performance is insufficient and pressure loss is high
Solution Approach 1:
The cooling fin employs curved surfaces and optimized geometric contours instead of straight linear profiles. The curved geometry enhances fluid flow attachment and increases effective heat transfer surface area, improving thermal performance while the streamlined shape reduces flow separation and pressure loss
Solution Approach 2:
The invention optimizes specific geometric parameters of the cooling fin including profile shape, thickness distribution, and spacing arrangements. By carefully selecting and adjusting these parameters, the design achieves superior thermal performance while maintaining acceptable pressure loss characteristics
2Reliability
If the fin surface area is increased to improve heat dissipation, then thermal performance improves, but the cooler size and complexity increase
Solution Approach 1:
The cooling fin design utilizes three-dimensional geometric features and varying thickness profiles instead of simple two-dimensional flat plates. This dimensional approach allows increased heat transfer surface area within a compact footprint, improving heat dissipation without proportionally increasing overall cooler size
Solution Approach 2:
The cooling fin is divided into multiple sections with different geometric characteristics along its length. Each segment is optimized for specific flow and thermal conditions, allowing the overall structure to achieve high heat dissipation efficiency while maintaining manufacturability through modular geometry
3Ease of manufacture
If punched sheet metal fins are used, then manufacturing is simple, but thermal performance does not meet requirements for power electronics cooling
Solution Approach 1:
The invention employs precise control of geometric parameters including profile shapes, thickness variations, and spacing patterns that can be achieved through modern forming processes. These parameter optimizations significantly enhance thermal performance while remaining compatible with manufacturing techniques such as roll forming and extrusion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves an advantageous ratio of thermal performance to pressure loss, enabling improved heat dissipation and cooling efficiency for power electronics, with the fin's design allowing for efficient fluid flow and heat transfer without excessive size increase.
Implementation Method 1
heat transfer between the fluid and the fin surface
Implementation Method 2
heat transfer surface and intensify the heat transfer
Data Source
AI summary
The present invention relates to a cooling fin (1) of a cooler (100), through which fluid can flow, for cooling power electronics (200). The cooling fin (1) comprises a profile (10) periodically repeating in a repeating direction (501), wherein the repeating direction (501) is perpendicular to an extending direction (500) of the profile (10). The invention also relates to a cooler (100), through which fluid can flow, for cooling power electronics (200), said cooler comprising a cooling fin (1) of said type, and to a power electronics assembly (1000), comprising power electronics (200) and a cooler (100) of said type, through which fluid can flow.