Semiconductor Cooling Fin Structure for Root-Focused Refrigerant Flow

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Solution Overview

Problem

Conventional cooling apparatuses for semiconductors face inefficiencies in heat transfer due to reduced refrigerant flow rates around the tips of cooling fins, leading to inadequate heat dissipation despite sufficient temperature differences.

Innovation Solution

A cooling apparatus design featuring a heat radiating plate with pin fins and a water jacket having protrusions with inclined slopes that direct refrigerant flow towards the roots of the pin fins, enhancing the flow rate and heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If protrusions are added to block refrigerant flow paths, then heat transfer to fin tips is improved, but refrigerant flow rate around fin roots decreases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidrefrigerant flow rate

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The protrusion features a slope with different orientations at different locations: the first slope (upstream side) faces the refrigerant flow to guide it toward the fin root, while the second slope (downstream side) faces away to prevent direct flow toward the fin tip. This local differentiation of surface orientation optimizes refrigerant distribution - directing flow where needed (at the root) while avoiding excessive flow where it would be harmful (at the tip), thereby resolving the contradiction between improving heat transfer and maintaining appropriate flow rates.

Inventive Principle:

Principle #3Local quality

2Productivity

If refrigerant flow rate is increased to improve cooling, then heat dissipation is enhanced, but pressure drop and pump load increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoidpump load

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The protrusion structure performs preliminary action by guiding and directing the refrigerant flow toward the fin root region before the refrigerant reaches the fins. The slope configuration pre-positions the refrigerant flow paths to optimize heat transfer efficiency at the fin root, which is where the most critical heat transfer occurs. This preliminary flow direction control achieves effective cooling without requiring excessive refrigerant flow rates, thereby reducing pressure drop and pump energy consumption.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly improves cooling efficiency by increasing refrigerant flow rates to the roots of the pin fins, effectively dissipating heat from the semiconductor targets while reducing pressure drop and pump load.

Implementation Method 1

the first protrusion includes a first slope inclined to the third surface, the first slope includes a first end and a second end, the first end is closer to the second surface than the second end, the second end is closer to the third surface than the first end, and the first end is positioned downstream in the flow direction from the second end

Methodology Applied

Scientific EffectFluid flow direction control:

Implementation Method 2

a refrigerant flows between the first member and the second member

Methodology Applied

Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 3

a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12178007B2Cooling apparatus and semiconductor apparatus with cooling apparatus

Publication Date: 2024.12.24 FUJI ELECTRIC CO LTD

AI summary

A cooling apparatus includes: a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and radiating fins protruding from the second surface; and a second member including a third surface facing the second surface, a refrigerant flows between the first member and the second member, the second member includes a first protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant, the first protrusion includes a first slope inclined to the third surface, the first slope includes a first end and a second end, the first end is closer to the second surface than the second end, the second end is closer to the third surface than the first end, the first end is positioned downstream in the flow direction from the second end.