Cooling Component Flow Deflection for Uniform Chip Heat Dissipation
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Solution Overview
Problem
Cooling components experience decreased cooling capacity and uneven heating of the cooling medium due to varying heat inputs from high-performance chips arranged in a matrix, leading to reduced performance further inside the component.
Innovation Solution
Incorporation of deflection devices that redirect and mix cooling medium flow within the cooling component, utilizing side-flow channels parallel to heat-sink channels to equalize temperature and reduce flow resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If cooling medium flows through parallel flow channels in sequence along rows of chips, then cooling coverage is improved, but cooling capacity decreases in flow direction due to medium heating
Solution Approach 1:
The cooling component is divided into multiple cooling zones with separate parallel flow channels, allowing the cooling medium to be segmented into different flow paths. This segmentation enables independent temperature control in each zone, preventing the cumulative heating effect that occurs in sequential flow configurations.
Solution Approach 2:
Different cooling zones are designed with locally optimized flow channel configurations to match the specific heat input requirements of each zone. The deflection device redirects cooling medium to areas with higher heat input, creating a non-uniform flow distribution that matches the local thermal load, thereby maintaining consistent cooling capacity across all zones.
2Area of stationary object
If chips are arranged in matrix configuration, then cooling surface utilization is improved, but uneven heating occurs due to varying heat input across flow direction
Solution Approach 1:
The cooling component implements zone-specific flow channel designs where inner cooling zones (with higher heat input from matrix chips) receive redirected cooling medium through deflection devices. This creates a non-uniform flow distribution that matches the local thermal load, ensuring temperature uniformity across the entire matrix configuration.
Solution Approach 2:
The deflection device acts as a passive feedback mechanism that automatically redirects cooling medium based on the thermal load distribution. Cooling medium that would otherwise flow through low-heat-input outer zones is deflected into inner zones with higher heat input, creating a self-regulating flow distribution that compensates for the uneven heating pattern.
3Temperature
If deflection device redirects cooling medium to equalize temperature, then cooling capacity uniformity is improved, but device complexity increases
Solution Approach 1:
The deflection device serves as a simple intermediary element that passively redirects cooling medium between flow channels using only the kinetic energy of the flowing medium. This passive deflection mechanism avoids the need for active control systems, complex valves, or powered actuators, thereby minimizing the increase in device complexity while achieving temperature equalization.
4Loss of energy
If side-flow channels are added parallel to heat-sink channels, then flow resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
The side-flow channels are merged with the existing heat-sink structure in a unified manufacturing process. The cooling component is designed as an integrated structure where side-flow channels and heat-sink channels are formed simultaneously using additive manufacturing or multi-axis machining, eliminating the need for separate assembly steps and reducing overall manufacturing complexity despite the increased channel count.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling performance by equalizing medium temperature and reducing flow resistance, maintaining consistent cooling capacity across different heat input zones.
Implementation Method 1
The heat sink then absorbs the waste heat of the object to be cooled, which, in turn, is then dissipated by the cooling medium
Implementation Method 2
The cooling medium flows inside the cooling component through the flow channels of the cooling component
Data Source
AI summary
A cooling component for the dissipation of heat from objects to be cooled, includes an inlet through which cooling medium can be supplied to the cooling component, with flow channels connected in parallel through which the cooling medium supplied via the inlet flows, and an outlet through which the cooling medium can be discharged from the cooling component, in particular, after the absorption of heat from an object to be cooled. The cooling component comprises at least one deflection device arranged downstream of the parallel flow channels, to which the cooling medium flowing in a main flow direction through at least one of these parallel flow channels is led and from which the cooling medium is diverted laterally so that it continues to flow laterally downstream of the deflection device offset to the aforesaid main flow direction.