Cooling Fluid Flow Regulation Using Orifices and Regulators
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Solution Overview
Problem
Current cooling systems for electronic devices face challenges in achieving evenly distributed cooling fluid flow due to the lack of commercially available spring-based flow regulators that can handle the required flow rates and tolerances for low thermal loads, making it difficult to efficiently remove heat from electronic devices using air or fluid cooling methods.
Innovation Solution
A system and method for regulating and distributing cooling fluid flow through a plurality of heat sinks using a flow regulator coupled with individual orifices, which are connected to a distribution header and fluid lines, ensuring consistent flow distribution across multiple cold plates despite upstream and downstream variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If commercially available spring-based flow regulators are used, then the system can be manufactured with standard components, but the flow rate and flow range tolerances are too wide for low thermal load electronic cooling applications
Solution Approach 1:
The system segments the flow regulation function into two distinct components: a flow regulator that controls total system flow and individual orifices at each cold plate inlet that distribute flow evenly to multiple cold plates. This segmentation allows the orifices to provide precise flow distribution (±5% or better) to each cold plate while the flow regulator handles overall flow control, resolving the contradiction between ease of manufacture and flow precision.
Solution Approach 2:
Orifices serve as intermediary flow distribution elements between the flow regulator and cold plates. These simple geometric restrictions act as mediators that convert the regulated total flow into evenly distributed individual cold plate flows, achieving high precision flow distribution without requiring complex regulated components at each cold plate inlet.
2Reliability
If individual cold plates are metered separately with standard flow regulators, then each cold plate receives controlled flow, but the system complexity increases significantly
Solution Approach 1:
The system merges the flow regulation function (performed by a single flow regulator) with the flow distribution function (performed by orifices at each cold plate inlet). This combination achieves reliable and uniform flow distribution to all cold plates while avoiding the complexity of installing individual flow regulators at each cold plate, thus resolving the contradiction between flow uniformity and system simplicity.
Solution Approach 2:
The orifices serve as universal flow distribution elements that can be applied to multiple cold plates simultaneously. A single flow regulator controls total flow that is then universally distributed to all cold plates through the orifice array, achieving reliable flow control across the entire system without requiring multiple specialized regulation devices.
3Device complexity
If air cooling is used, then the system is simpler than fluid cooling, but the heat removal capacity is insufficient for modern electronic devices
Solution Approach 1:
The system transitions from air cooling (gas) to fluid cooling (liquid) by implementing a liquid coolant circulation system with cold plates, orifices, and flow regulators. This hydraulic approach provides significantly higher heat removal capacity compared to air cooling while maintaining reasonable system complexity through the use of passive orifices for flow distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high-tolerance, evenly distributed cooling fluid flow to electronic devices, effectively addressing the limitations of existing systems by using a combination of flow regulators and orifices to manage pressure drops and ensure efficient heat absorption from electronic devices.
Implementation Method 1
efficient heat absorption from electronic devices
Implementation Method 2
manage pressure drops and ensure efficient heat absorption
Data Source
AI summary
The disclosure provides systems and methods for regulating and distributing cooling fluid through a plurality of heat sinks, such as cold plates, using a flow regulator, which sets the total flow rate, in combination with one or more individual orifices that allow further flow distribution as required by individual cold plates, despite flow variations upstream of the orifices. An orifice can be coupled to an orifice holder, which includes a body to support the orifice, and which may be coupled (directly or indirectly) to an inlet of the cold plate. Alternative manners of coupling orifices in the fluid flow besides an orifice holder can be employed. Generally, the flow regulator(s) is coupled with a plurality of orifices and conduits through which the cooling fluid flows. Related system components can be assembled as a module for installation into a cooling system that includes other system components such as a pump, compressor or other pressure sources for the cooling fluid.