Cooling Liquid Flow Valve for Adaptive Electronic Heat Dissipation
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Solution Overview
Problem
Conventional water-cooling modules for electronic components lack the ability to control the flow rate of cooling liquid, which limits their effectiveness in optimizing heat dissipation across varying load states and electrical loads.
Innovation Solution
A cooling liquid flow control device comprising a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element with a valve that adjusts flow rate based on the temperature of the heating element, utilizing a processing unit to convert temperature signals into current outputs that control the valve's displacement and flow rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional water-cooling module is used without flow control, then the structure is simple, but the heat dissipation optimization capability is poor
Solution Approach 1:
The cooling liquid flow control device uses the heating element's own temperature to automatically control the flow rate through the temperature control element, eliminating the need for external control systems. The system serves itself by using its thermal state to regulate its own cooling flow
Solution Approach 2:
The device changes the flow rate parameter of cooling liquid based on the temperature parameter of the heating element. As temperature changes, the valve reciprocally moves to adjust the flow rate, creating a dynamic parameter relationship that optimizes heat dissipation
2Stability of the object's composition
If the cooling liquid flow rate is fixed, then the system is stable, but the adaptability to different load states is poor
Solution Approach 1:
The cooling liquid flow rate is transformed from a fixed parameter to a dynamic one that automatically adjusts with the heating element's temperature. The valve's reciprocating movement creates a dynamic flow control system that adapts to varying thermal loads while maintaining system stability through continuous feedback
Solution Approach 2:
The system establishes a feedback loop where the heating element's temperature controls the valve position, which in turn regulates the cooling liquid flow rate. This closed-loop feedback mechanism enables automatic adaptation to different load states while maintaining stable operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables proportional control of the cooling liquid flow rate, optimizing energy efficiency by adjusting flow according to the heating element's state, thereby enhancing heat dissipation and reducing energy consumption.
Implementation Method 1
the processing unit is further configured to convert the signal to a current output to the coil, wherein the current causes a displacement of the valve
Implementation Method 2
The heat dissipation bottom plate has a bottom surface configured to be in contact with the heating element on a substrate
Data Source
AI summary
A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.