Multi-Function Cooling Fluid Tubes for Electronic Device Thermal Management
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Solution Overview
Problem
Current thermal management techniques, such as convection cooling, are inadequate for densely populated electronic devices with high heat-generating components, as they require adequate airflow which may not be available in all applications, and existing liquid cooling standards like VITA 48.4 complicate chassis design and access.
Innovation Solution
An electronic device design incorporating a cooling fluid manifold and rotatably mounted cooling fluid tubes with keyed surfaces, allowing for flexible placement and easy decoupling, coupled with a heat exchanger and fluid transfer system for efficient liquid cooling, which can handle high heat loads and integrate with various thermal elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If convection cooling is used, then cooling effectiveness is improved, but adequate airflow and exposed surface area are required which may not be available in densely populated electronic devices
Solution Approach 1:
The patent transitions from air convection cooling to liquid cooling by introducing a cooling fluid manifold with fluid tubes that directly contact heat-generating components. The liquid cooling system overcomes the limitation of inadequate airflow by using liquid coolant circulation through channels in contact with electronic components, enabling effective heat removal in densely populated devices where air circulation is restricted.
2Temperature
If liquid cooling is implemented according to existing standards like VITA 48.4, then thermal management capability is improved, but chassis design complexity and access difficulty increase
Solution Approach 1:
The cooling system is segmented into a manifold structure with multiple independent fluid tubes, each serving specific heat-generating components. This modular segmentation allows the cooling system to be integrated into existing chassis designs without requiring complete redesign, as each tube can be independently routed and connected to relevant components.
Solution Approach 2:
The cooling fluid manifold is designed to serve multiple functions: it provides thermal management for various electronic components, maintains structural integrity within the chassis, and allows for flexible configuration to accommodate different device layouts. The manifold structure can be adapted to different chassis types and component arrangements, reducing overall system complexity.
3Temperature
If cooling fluid tubes are fixed in position, then thermal contact is optimized, but flexibility in placement and ease of decoupling are reduced
Solution Approach 1:
The cooling fluid tubes are designed with rotational capability around their longitudinal axes, allowing them to be dynamically adjusted to different angular positions. This dynamic feature enables the tubes to maintain optimal thermal contact with heat-generating components while allowing flexible placement and easy decoupling when components need to be removed or repositioned, without compromising thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal capability beyond traditional air convection methods, providing flexible and efficient liquid cooling that is accessible and integrates well with different thermal architectures, addressing the limitations of existing standards.
Implementation Method 1
heat is transferred via a heat sink positioned on one surface of the circuit board and in contact with components on the circuit board
Implementation Method 2
Cooling liquid is passed within the heatsink to cool the circuit board
Data Source
AI summary
An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.