Cooling Frame for PECVD Diffuser Temperature Control
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Solution Overview
Problem
Conventional substrate processing systems face challenges in maintaining diffuser temperatures within a desired range during plasma enhanced chemical vapor deposition (PECVD), leading to substrate quality issues and potential damage due to temperature fluctuations.
Innovation Solution
The implementation of a cooling frame with fluid lumens that circulate a cooling fluid around the diffuser, maintaining its temperature below 150°C, thereby controlling temperature drift and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If PECVD processing is performed with plasma generation and heating, then thin film deposition is achieved, but diffuser temperature increases causing substrate quality reduction and diffuser damage
Solution Approach 1:
A cooling frame is introduced as an intermediary component between the diffuser and the chamber environment. The cooling frame includes fluid lumens that circulate cooling fluid to actively remove heat from the diffuser, preventing temperature-induced quality degradation while maintaining the PECVD processing functionality
Solution Approach 2:
The cooling system utilizes phase transition of the cooling fluid (liquid to vapor and back) within the fluid lumens to efficiently absorb and transport heat from the diffuser. This phase change mechanism provides effective thermal management to maintain diffuser temperature within acceptable ranges
2Reliability
If cooling frame with fluid lumens is added to control diffuser temperature, then substrate quality and chamber integrity are improved, but device complexity increases
Solution Approach 1:
The cooling frame is merged with the existing diffuser assembly structure, combining the cooling function with the gas distribution function in a unified component arrangement. The fluid lumens are integrated into the cooling frame body, eliminating the need for separate external cooling components and reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures consistent deposition characteristics and chamber integrity, improving substrate quality and preventing diffuser damage by actively managing temperature fluctuations.
Implementation Method 1
The cooling frame may include a body having one or more fluid inlets and one or more fluid outlets. The body may define an opening. The one or more fluid inlets may be in fluid communication with the one or more fluid outlets via one or more fluid lumens that each extend at least partially about a periphery of the opening.
Implementation Method 2
The cooling frame may be coupled with the diffuser. The cooling frame may include two or more fluid inlets, two or more fluid outlets, and two or more fluid lumens.
Data Source
AI summary
Exemplary substrate processing chambers may include a chamber body defining a processing region. The chambers may include a backing plate disposed atop the chamber body, a diffuser above the processing region and supported by the backing plate, and a cooling frame disposed between the backing plate and the diffuser. The cooling frame may be coupled with the diffuser. The cooling frame may include a body having one or more fluid inlets and one or more fluid outlets. The body may define an opening. The fluid inlets may be in fluid communication with the one or more fluid outlets via one or more fluid lumens that each extend at least partially about a periphery of the opening. The fluid inlets may be in fluid communication with one or more fluid supply lumens. The fluid outlets may be in fluid communication with one or more fluid return lumens.